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Chip overlapping assembly device

An assembly device and chip mounting technology, which is applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve the problems of high error rate, high investment cost, slow production cycle, etc., and achieves low error probability, low investment cost, The effect of fast assembly

Pending Publication Date: 2020-11-06
无锡林泰克斯新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1) Manual shuffle assembly, manually select the assembly chip model alternately, and then invest in the identification tool to identify the assembly sequence to determine whether there is a risk of assembly failure. The disadvantage of this device is that the production rate is slow and the error rate is extremely high.
[0005] 2) Assembled by the manipulator, the automatic pick-up device picks up the corresponding product model according to the PLC command. This process has high production capacity and low failure risk, but the investment cost is relatively high for projects with low output value or weak profitability.

Method used

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Embodiment Construction

[0024] The present invention will be further described below according to the drawings.

[0025] Such as Figure 1-6 As shown, the chip overlapping assembly device includes a main body panel 1 and a chip mounting block 2. There are two main body panels 1, and the bottom of one end of the two main body panels 1 is provided with a weightless folding support frame 5, and the two main body panels The other ends of 1 are connected by a pin shaft 3, the pin shaft 3 is provided with a limit spring 4, and each of the main body panels 1 is provided with a mounting groove, and the chip mounting block 2 is disposed in the mounting groove; The chip mounting block 2 includes a handle 6, a base 7 and a tank body 8, the handle 6 is connected to the base 7 or is integrated, the base 7 is provided with a plurality of tank bodies 8, and the tank body 8 There are a plurality of vertically upward spacer bars 9 between them. An arc-shaped cut edge 10 is respectively arranged on both sides of the ...

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Abstract

The invention relates to a chip overlapping assembly device, and belongs to the field of quick assembly processes and tools for a gearbox friction plate group. The chip overlapping assembly device comprises two main body panels and two chip mounting blocks. Gravity-free folding support frames are arranged at the bottoms of one ends of the two main body panels. The other ends of the two main body panels are connected by a pin. A limit spring is arranged on the pin. Each main body panel is provided with a mounting groove. The chip mounting blocks are arranged in the mounting grooves. Each chip mounting block comprises a handle, a base and groove bodies, wherein the handle is connected with the base, the base is provided with a plurality of groove bodies, and a plurality of vertical upward spacing bars are arranged between the groove bodies. An arc-shaped trimmed edge is arranged on each of two sides of each spacing bar. The position of each trimmed edge is arranged near the top face of the corresponding spacing bar. The chip overlapping assembly device has the advantages of convenient operation, fast assembly speed, low error probability, simple mechanism, convenient maintenance andlow investment cost.

Description

technical field [0001] The invention relates to a chip overlapping assembly device, which belongs to the field of rapid assembly process tooling for friction plate groups of gearboxes. [0002] technical background [0003] The existing assembly methods generally have two methods: manual and automatic: [0004] 1) Manual shuffle assembly, manually select the assembly chip model alternately, and then invest in the identification tool to identify the assembly sequence to determine whether there is a risk of assembly failure. The disadvantage of this device is that the production rate is slow and the error rate is extremely high. [0005] 2) Assembled by manipulators, the automatic pick-up device picks up the corresponding product model according to PLC instructions. This process has high production capacity and low failure risk, but the investment cost is relatively high for projects with low output value or weak profitability. Contents of the invention [0006] The purpose ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P19/00
CPCB23P19/00
Inventor 陆晓丹袁国华曹一军
Owner 无锡林泰克斯新材料科技股份有限公司
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