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Plating device

A technology of electroplating device and electroplating tank, which is applied in the direction of electrolytic components, electrolytic process, cells, etc. It can solve the problems of electroplating liquid splashing upwards, the opening of the electroplating tank is full of stains, and water cannot be fully utilized, etc., so as to achieve easy pick-and-place, Prevents the effect of splashing upwards

Active Publication Date: 2021-12-17
昆山蕴鼎自动化科技有限公司
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  • Claims
  • Application Information

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Problems solved by technology

Most of the electroplating devices in the prior art are open structures. Although it is convenient to take and place the racks, there is a phenomenon that the electroplating solution splashes upwards. On the one hand, the sprayed water cannot be fully utilized; , around the opening of the electroplating tank is full of stains

Method used

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Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0026] Examples of the described embodiments are shown in the drawings, wherein like or similar reference numerals designate like or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0027] In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrate...

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Abstract

The invention discloses an electroplating device, which comprises an electroplating tank, a stirring plate, a swing mechanism and a cover assembly. One end of the plating tank is open, and the stirring plate is movably arranged in the plating tank. The stirring plate is driven to move directionally to achieve uniform stirring. The cover assembly includes a first cover part, a second cover part and a driving part. The driving part is connected to the first cover part and the second cover part by transmission. The first cover part The part and the second cover part are respectively arranged on both sides of the opening of the electroplating tank to realize opening or covering of the opening of the electroplating tank. The invention provides an electroplating device. A cover plate assembly is arranged at the open end of the electroplating tank. After the cover plate assembly is closed, the electroplating solution can be effectively prevented from splashing upwards. On the one hand, the electroplating solution can be fully utilized; Ensure that the environment around the opening of the electroplating tank is clean and tidy; after the cover plate assembly is opened, it is convenient to pick and place the hanger, which is convenient and practical.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating device. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of the workpiece by using the theory of electrodeposition, so as to prevent metal oxidation (such as rust), improve wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhance aesthetics. Most of the electroplating devices in the prior art are open structure. Although it is convenient to take and place the hanger, there is a phenomenon that the electroplating solution splashes upwards. On the one hand, the sprayed water cannot be fully utilized. On the other hand, after a long time working , around the opening of the electroplating tank is full of stains. Contents of the invention [0003] The invention provides an electroplating device, comprising: [0004] An electroplating tan...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/00C25D21/10C25D5/08
CPCC25D17/00C25D21/10C25D5/08
Inventor 倪裕林徐新志尹旺王健忠
Owner 昆山蕴鼎自动化科技有限公司
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