Sputtering chamber, pre-cleaning chamber and plasma processing equipment

Abstract

The invention discloses a sputtering chamber, a pre-cleaning chamber and plasma processing equipment. The sputtering chamber comprises a cavity, a target, an electrostatic chuck and an inductance coil, wherein the target is arranged at the top end of the cavity and is connected with a power supply; the electrostatic chuck is arranged at the bottom of the cavity; and the inductance coil is arranged at the outer side of the cavity. The sputtering chamber can be used for preventing the inductance coil from being sputtered by plasma, thereby the service life of the inductance coil is prolonged, the use cost of the sputtering chamber is reduced, particle pollution sources in the sputtering chamber are reduced, the pollution caused by particles deposited on the surface of the inductance coil to processed workpieces is avoided and the utilization rate of the target is improved. According to the pre-cleaning chamber, a top cover can be designed to be an easily-processed structure, so that an arched structure with higher processing cost is avoided, and further the processing cost of the top cover is reduced, the adhesive force of the particles and the top cover is improved and the pollution of the particles attached to the surface of the top cover to the processed workpieces positioned below the top cover is reduced and even avoided.

Description

technical field

[0001] The invention relates to the technical field of semiconductor processing, and relates to a sputtering chamber, a pre-cleaning chamber and plasma processing equipment. Background technique

[0002] Plasma processing equipment is widely used in today's semiconductor integrated circuits, solar cells, flat panel displays and other manufacturing processes. Plasma processing equipment that has been widely used in the industry is of the following types: for example, a DC discharge type, a capacitive coupling (CCP) type, an inductive coupling (ICP) type, and an electron cyclotron resonance (ECR) type. These types of plasma processing equipment are currently used in processes such as deposition, etching, and cleaning.

[0003] Sputtering chamber is a kind of deposition equipment that is often used. It connects a high-power DC power supply to the target, and the plasma generated by the DC power supply bombards the target, thereby depositing the material of the ...

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