Laser-electrolysis composite machining device and method of tiny holes in non-recast layer
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 临沂市奥林欧克工具有限公司
- Publication Date
- 2014-09-03
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
Technical field
[0001] The invention relates to a processing device and method for micro-holes without a recast layer, in particular to a laser-electrolytic composite processing device and method without micro-holes in a recast layer. Background technique
[0002] At present, the wide application of micro-hole structure in precision equipment products and aviation industry has made micro-hole processing technology aroused widespread concern in the scientific and engineering communities at home and abroad. Micro-hole processing methods are divided into three categories: mechanical processing, special processing and compound processing. Mechanical processing mainly includes mechanical drilling and mechanical punching; special processing mainly includes laser processing, electric discharge processing, electrochemical processing, ultrasonic processing, electron beam processing, ion beam processing, etc.
[0003] For some tiny holes with special technical requirements or on parts made ...