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Laser-electrolysis composite machining device and method of tiny holes in non-recast layer

A technology of compound machining and tiny holes, applied in the field of laser-electrochemical compound machining devices without tiny holes in the recast layer, can solve the problems such as insufficient removal of the recast layer, damage to important parts of the workpiece, and difficulty in removing dead corners, achieving electrolytic machining. The effect of good quality, high quality and efficient processing, and reduced workload

Inactive Publication Date: 2014-09-03
临沂市奥林欧克工具有限公司
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AI Technical Summary

Problems solved by technology

This method can obtain better surface quality, but it is difficult to remove the dead corners, and the removal of the recast layer is not uniform enough
Recently, it has also been proposed to use a specific chemical solution to corrode the workpiece to remove the recast layer. This method is based on the principle that the recast layer and the matrix material have different corrosion resistance to the chemical solution due to the difference in structure and composition. The advantages of uniform casting layer and good economy, but poor versatility, and may damage important parts of the workpiece to a certain extent

Method used

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with the drawings.

[0033] See figure 1 , A laser-electrolytic composite processing device without micro-holes in the recast layer includes a machine tool base 11 provided with a workpiece fixture 13, a machine tool column 17 is vertically provided on the machine tool base 11, and a y-axis worktable 10 is provided under the workpiece fixture 13. An x-axis worktable 9 is arranged under the y-axis worktable 10, and a positioning plate 8 is arranged on one side of the x-axis worktable 9. The conversion motor 2 is fixed on the machine tool column 17 through the z-axis worktable 16, and the z-axis worktable 16 is connected There is a z-axis servo motor 18, the x-axis worktable 9, the y-axis worktable 10 and the z-axis worktable 16 are all connected to the computer, and the electrochemical machining system fixed on the machine tool column 17 is fixed on the machine tool column 17 and converted by the conversion...

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Abstract

The invention discloses a laser-electrolysis composite machining device and method of tiny holes in a non-recast layer. The device and method aim to solve the problem that in the prior art, it is difficult to effectively machine tiny holes without defects. The device comprises a machine tool base and a machine tool stand column, wherein the machine tool base is provided with a workpiece fixture, and the machine tool stand column is perpendicularly arranged on the machine tool base. An electrolysis machining cathode spray nozzle and a laser emission head are arranged above the workpiece fixture, wherein the electrolysis machining cathode spray nozzle and the laser emission head are fixed to the machine tool stand column and are driven through a conversion motor. The electrolysis machining cathode spray nozzle and the laser emission head are arranged with the axes in the same plane, and converted through the conversion motor, so that the advantages of high efficiency in laser machining and good quality in electrolysis machining are integrated, and high-quality and efficient machining of tiny group holes is achieved.

Description

Technical field [0001] The invention relates to a processing device and method for micro-holes without a recast layer, in particular to a laser-electrolytic composite processing device and method without micro-holes in a recast layer. Background technique [0002] At present, the wide application of micro-hole structure in precision equipment products and aviation industry has made micro-hole processing technology aroused widespread concern in the scientific and engineering communities at home and abroad. Micro-hole processing methods are divided into three categories: mechanical processing, special processing and compound processing. Mechanical processing mainly includes mechanical drilling and mechanical punching; special processing mainly includes laser processing, electric discharge processing, electrochemical processing, ultrasonic processing, electron beam processing, ion beam processing, etc. [0003] For some tiny holes with special technical requirements or on parts made ...

Claims

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Application Information

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IPC IPC(8): B23H5/00B23H9/14
Inventor 王恪典高伟芳段文强梅雪松凡正杰
Owner 临沂市奥林欧克工具有限公司
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