A double-layer high-strength flexible circuit board with internal reinforcement mechanism

A flexible circuit board and circuit board technology, which is applied in the direction of printed circuits, circuit heating devices, printed circuit components, etc., can solve the problems of increasing the strength and toughness of circuit boards, adding reinforcement boards, and reducing the air permeability of circuit boards. Achieve the effect of increasing strength and toughness, increasing service life and increasing protection effect

Active Publication Date: 2022-03-11
深圳市腾鑫精密电子芯材科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the double-layer flexible circuit board needs to be installed with electronic components on both sides, the double-sided flexible circuit board cannot add a reinforcing plate on the back to increase the strength and toughness of the circuit board like a single-layer circuit board. The reinforcement structure is added to the inner side of the board, but adding the reinforcement structure from the inner layer will reduce the air permeability and heat dissipation effect of the circuit boards on both sides, resulting in the inability of the circuit board to dissipate heat reasonably during use, resulting in high temperature affecting the use of the circuit board, and now Some double-layer flexible circuit boards cannot be effectively positioned when the reinforcement structure is added, which may cause the flexible circuit board to slide on both sides of the reinforcement structure, affecting the use effect, and the strength of the flexible circuit board itself cannot be guaranteed, and may break. For this reason, the present invention proposes a double-layer high-strength flexible circuit board with internal reinforcement mechanism to solve the above problems

Method used

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  • A double-layer high-strength flexible circuit board with internal reinforcement mechanism
  • A double-layer high-strength flexible circuit board with internal reinforcement mechanism
  • A double-layer high-strength flexible circuit board with internal reinforcement mechanism

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Embodiment Construction

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0014] see Figure 1 to Figure 3 , the present invention provides a technical solution: a double-layer high-strength flexible circuit board with an internal reinforcement mechanism, including a circuit board 1, a reinforcement board 3 and a heat dissipation structure, and the circuit board 1 is bonded to the On the outer side of the reinforcement board 3, the reinforcement board 3 and the circuit board 1 are fixedly connected to both sides of the heat dissipat...

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Abstract

The invention relates to the technical field of circuit boards, in particular to a double-layer high-strength flexible circuit board with an internal reinforcement mechanism, including a circuit board, a reinforcement board and a heat dissipation structure, and the circuit board is bonded to the reinforcement board by an adhesive On the outside, the reinforcement board and the circuit board are fixedly connected on both sides of the heat dissipation structure by positioning screws. The heat dissipation structure includes a heat conduction plate. There are a number of evenly distributed heat conduction columns protruding from both ends of the heat conduction plate. The heat conduction columns pass through the reinforcement plate to connect the lines. The support column is welded between the board and the heat conduction board, and the beneficial effect is: a reinforcement structure and a heat dissipation structure can be added between the double-layer flexible circuit boards, and the strength and toughness of the flexible circuit board can be increased through the reinforcement structure, and the protection effect can be increased. The structure can increase the heat dissipation effect between the circuit boards, prevent the circuit board from being affected by high temperature, and protect the circuit board from high temperature damage, and the heat dissipation structure can also increase the strength of the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a double-layer high-strength flexible circuit board with an internal reinforcing mechanism. Background technique [0002] Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. A double-layer flexible circuit board is a combination of two-layer flexible circuit boards. [0003] Since the double-layer flexible circuit board needs to be installed with electronic components on both sides, the double-sided flexible circuit board cannot add a reinforcing plate on the back to increase the strength and toughness of the circuit board like a single-layer circuit board. The reinforcement structure is added to the inner side of the board, but adding the reinforcement structure from t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/14
CPCH05K1/0281H05K1/0209H05K1/02H05K1/0206H05K1/0271H05K1/147
Inventor 王跃杰肖引珍
Owner 深圳市腾鑫精密电子芯材科技有限公司
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