Device for cutting materials through ultrahigh-frequency fiber laser and working method of device

Abstract

The invention relates to a device for cutting materials through an ultrahigh-frequency fiber laser and a working method of the device. The device comprises the ultrahigh-frequency fiber laser, a beamexpander, a reflector and a galvanometer which are connected in sequence, an optical fiber conveying device is arranged in the ultrahigh-frequency fiber laser, and the galvanometer is connected with avisual positioning system, wherein the monopulse energy of the ultrahigh-frequency fiber laser is larger than 1 micro-joule. According to the device for cutting materials through the ultrahigh-frequency fiber laser and the working method of the device. The ultrahigh-frequency and low-pulse-width fiber laser is adopted and matched with automatic mechanisms such as a rolling platform to cut materials, compared with a nanosecond infrared laser and a green laser, the ultrahigh-frequency and low-pulse-width fiber laser has the beneficial effects of being high in cutting speed, small in heat influence, low in cost and simple and flexible in equipment, and the cutting speed and the cutting quality are greatly improved.

Description

technical field [0001] The invention relates to the technical field of laser cutting, and more specifically refers to equipment for cutting materials with an ultra-high frequency fiber laser and a working method thereof. Background technique [0002] When making thin sheets such as electrode sheets of lithium batteries, cutting is required so that the entire thin material can be made into a specified object. At present, for the cutting of thin materials, the quality of the cutting edge has an important impact on the performance and quality of the equipment , For example, it has a certain impact on the heat dissipation and charging and discharging performance of the device. [0003] In the prior art, nanosecond infrared lasers or green lasers are used to cut thin materials. Although these two lasers can meet the basic cutting requirements, the cutting frequency of these two types of lasers is not high, resulting in slow cutting speed and The overall thermal impact is relativ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, nanosecond infrared lasers or green lasers are used to cut thin materials. Although these two types of lasers can meet the basic cutting requirements, the cutting frequency of these two types of lasers is not high, resulting in slower cutting speeds, and The overall thermal impact is relatively large, which can easily lead to lower quality of the finished product after cutting

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