Flexible heat dissipation hinge for folding electronic equipment

Abstract

The invention relates to a flexible heat dissipation hinge for folding electronic equipment. The flexible heat dissipation hinge comprises a flexible heat conduction band, a left fixing shaft, a rightfixing shaft, a shaft seat, a large cover plate and a small cover plate; the heat conduction band is composed of a wide band surface heat conduction section and a narrow band surface heat conductionsection; the two fixing shafts consist of shaft plates and end rings; a cavity is arranged in the shaft seat, shaft holes are formed in the two ends of the shaft seat, and a band penetrating hole is formed in the bottom of the shaft seat; the shaft seat penetrates through a shaft seat penetrating hole in the heat conduction band and is fixedly connected with the upper end of a folding electronic equipment host; plugboard parts on the two fixing shafts are respectively in plug-in fit with two sides of one end, close to a narrow band surface, of the wide band surface heat conduction section, andare fixedly connected with a screen front cover of the folding electronic equipment; the end rings of the two fixing shafts are respectively plug-in fit with shaft holes at two ends of the shaft seat; the wide band surface heat conduction section is in contact with the inner surface of a screen rear cover of the folding electronic equipment and is pressed on the screen rear cover through the large cover plate; and the narrow band surface heat conduction section is led out from the band penetrating hole, is in contact with the heat source surface of a circuit board and is pressed on the electronic equipment host through the small cover plate. According to the flexible heat dissipation hinge, the non-coplanar heat transfer requirement is met.

Description

technical field [0001] The invention belongs to the technical field of heat transfer on electronic equipment, and relates to a heat dissipation hinge structure on electronic equipment, in particular to a flexible heat dissipation hinge used for folding electronic equipment. Background technique [0002] For large-scale (≥150mm) heat transfer, heat pipes or vapor chambers are usually used as heat transfer components. However, when the space is more complex and there is relative movement between heat transfer components, hard heat transfer components such as heat pipes are difficult competent. In addition, in order to meet the lightweight requirements, there is an urgent need for a flexible, high-efficiency, and light-weight heat transfer component to replace the traditional high-density copper and aluminum heat transfer components to solve some unconventional heat dissipation problems. [0003] At present, according to the heat dissipation layout of folding electronic device...

AI Technical Summary

Problems solved by technology

[0003] At present, according to the heat dissipation layout of folding electronic devices, various heat dissipation hinge structures are derived, all of which are combined structures of

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