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Elastic heat-conducting structure, manufacturing method thereof and electronic device

A technology of elastic heat conduction and electronic devices, which is applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, electrical components, etc., and can solve problems such as increased weight and thickness, high density, and poor structural strength of polymer composite materials , to achieve the effect of good heat conduction and high heat conduction

Active Publication Date: 2020-11-10
CTRON ADVANCED MATERIAL CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the thermal conductivity of metal materials is very good, the density is high, which will increase the overall weight and thickness
However, the structural strength of polymer composite materials doped with inorganic materials is not good, and may not be suitable for some products

Method used

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  • Elastic heat-conducting structure, manufacturing method thereof and electronic device
  • Elastic heat-conducting structure, manufacturing method thereof and electronic device
  • Elastic heat-conducting structure, manufacturing method thereof and electronic device

Examples

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Embodiment Construction

[0025] The elastic heat conduction structure and its manufacturing method, and the electronic device according to some embodiments of the present invention will be described below with reference to the relevant drawings, wherein the same components will be described with the same reference symbols. Components appearing in the following embodiments are only schematic and do not represent real scales or dimensions.

[0026] The elastic heat conduction structure of the present application can be applied to, for example but not limited to, mobile phones, notebook computers, tablet computers, televisions, monitors, backlight modules, or computer equipment related to servers, or unmanned aerial vehicles, audio-visual equipment (such as speakers), photography lenses Or camera lenses, or electronic devices in other fields, are not limited. The elastic heat conduction structure of the present application can not only achieve higher heat conduction and heat extraction efficiency through...

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Abstract

An elastic heat conduction structure is matched with an electronic device for application, and the elastic heat conduction structure is arranged between a heat source of the electronic device and a bearing piece, and comprises a substrate, a patterned heat conduction supporting piece and a heat conduction elastic piece. The substrate is provided with a first surface and a second surface opposite to the first surface, the patterned heat conduction supporting piece is arranged on the first surface, the heat conduction elastic piece is arranged on the substrate and covers the patterned heat-conduction supporting piece, and the heat conduction elastic piece is provided with a third surface far away from the patterned heat conduction supporting piece, wherein when the distance between the heatsource and the bearing piece is a constant value, the compression amount X of the heat conduction elastic piece and the temperature difference Y between the third surface of the heat conduction elastic piece and the second surface of the substrate meet the formula that Y =-0.0004X2 + 0.0973X+ 19.039. The invention further discloses a manufacturing method of the elastic heat conduction structure and the electronic device.

Description

technical field [0001] The present invention relates to an elastic heat conduction structure and its manufacturing method and electronic device, in particular to an elastic heat conduction structure with compressible properties and its manufacturing method, and an electronic device with the elastic heat conduction structure. Background technique [0002] With the development of science and technology, for the design and development of electronic devices, thinness and high performance are always given priority. In the case of high-speed computing and thinning, the electronic components of electronic devices will inevitably generate more heat than before. Therefore, "heat dissipation" has become an indispensable function of these components or devices. Especially for high-power components, due to the substantial increase in heat generated during work, the temperature of electronic products will rise rapidly. When electronic products are subjected to excessive temperatures, it ...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2049
Inventor 萧毅豪
Owner CTRON ADVANCED MATERIAL CO LTD
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