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Wafer-level chip packaging structure and preparation method

A wafer-level chip and packaging structure technology, used in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as difficult process operations, wafer-level chip packaging warpage, etc., to avoid damage and re-wiring layer, improve process capability, protect the effect of integrity

Pending Publication Date: 2020-11-13
SJ SEMICON JIANGYIN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the wafer-level chip packaging method often causes a large warpage of the packaging structure, resulting in difficulties in process operations
[0004] Based on the above, the purpose of the present invention is to provide a wafer-level chip packaging structure and preparation method to solve the warping problem of wafer-level chip packaging

Method used

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  • Wafer-level chip packaging structure and preparation method
  • Wafer-level chip packaging structure and preparation method
  • Wafer-level chip packaging structure and preparation method

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Embodiment Construction

[0045] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0046] see Figure 1 to Figure 5 . It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

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Abstract

The invention provides a wafer-level chip packaging structure and a preparation method thereof. The wafer-level chip packaging structure comprises a substrate; a rewiring layer which is formed on thesubstrate and provided with a scribing groove area; a packaging layer which is formed on the rewiring layer; and a groove which is formed in the packaging layer, and located in the scribing groove area. According to the wafer-level chip packaging structure and the preparation method thereof, the stress in the packaging structure can be released, the warping degree of the wafer is reduced, the process stability is improved, the yield is improved, and output is increased.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, and in particular relates to a wafer-level chip packaging structure and a preparation method. Background technique [0002] Wafer Level Chip Scale Packaging (WLCSP for short), that is, wafer-level chip packaging, is different from the traditional chip packaging method (cutting first and then packaging and testing, and at least 20% of the original chip is added after packaging). Volume), this latest technology is to package and test on the whole wafer first, and then cut into IC particles one by one, so the volume after packaging is equal to the original size of IC die. The WLCSP packaging method not only significantly reduces the size of the memory module, but also meets the high-density requirements of mobile devices for the body space; on the other hand, in terms of performance, it improves the speed and stability of data transmission. [0003] Wafer-level chip-scale packaging technology...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/498H01L21/56
CPCH01L21/561H01L23/3114H01L23/3121H01L23/49838
Inventor 徐罕陈彦亨吴政达林正忠
Owner SJ SEMICON JIANGYIN CORP