Chip carrier and semiconductor packaging structure

Abstract

The invention discloses a chip carrier and a semiconductor packaging structure, the top of the chip carrier is used for bearing a chip, and the chip carrier is transversely provided with a plurality of lower heat dissipation channels; a lower liquid inlet and a lower liquid outlet are formed in the side wall of the chip carrier, and the two ends of the lower heat dissipation channel are communicated with the outside through the lower liquid inlet and the lower liquid outlet respectively; the semiconductor packaging structure comprises the chip carrier and further comprises a chip and packagingglue, the chip is fixed to a chip carrying area of the chip carrier, and the packaging colloid wraps the chip and the chip carrier. The chip carrier and the semiconductor packaging structure providedby the invention have good heat dissipation performance.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a chip carrier and a semiconductor packaging structure. Background technique [0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields; the semiconductor packaging structure is to fix the chip (or chip) to the corresponding chip carrier, between the chip and the chip carrier After completing the necessary electrical connections, in order to prevent the internal circuit from being polluted by liquid, dust and gas in the environment, a layer of protective encapsulant is coated on the chip and the chip carrier to form a semiconductor package structure; however, for high-power As far as the semiconductor packaging structure is concerned, the internal power devices are prone to generate heat during operation. If the heat cannot be transferre...

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Problems solved by technology

[0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields; the semiconductor packaging structure is to fix the chip (or chip) to the corresponding chip carrier, between the chip and the chip carrier After completing the necessary electrical connections, in order to prevent the internal circuit from being polluted by liquid, dust and gas in the environment, a layer of protective encapsulant is coated on the chip and the chip carrier to form a semiconductor package structure; however, for high-power As far as the semiconductor packaging structure is concerned, the internal power devices are prone to generate heat during operation. If the heat cannot be transferred to the outside of the semiconductor packaging structure in a timely and effective manner, the accumulated heat will greatly affect the performance of the chip, thereby affecting the reliability of the semiconductor packaging structure.

[0003] In the prior art, the heat generated by the chip is generally conducted to the outside atmosphere through the encapsulation compound. However, the thermal conductivity of the encapsulation compound is not good, which leads to the poor heat dissipation performance of the existing semiconductor packaging structure.

There are still some semiconductor packaging structures on the market. The heat dissipation of the semiconductor packaging structure is realized by adding a metal radiator (such as a toothed radiator) on the semiconductor packaging structure. However, due to the heat exchange efficiency between the radiator and the chip, the heat dissipation The heat exchange efficiency between the device and the atmosphere is relatively limited, resulting in limited heat dissipation performance of the existing semiconductor package structure

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