Cake type solid insulation high-frequency transformer based on 3D printing

A high-frequency transformer, solid insulation technology, applied in transformer/inductor housing, transformer/inductor cooling, transformer/inductor components, etc. Complex structure and other problems, to solve the problem of matching leakage inductance and main inductance, realize inductance matching, and achieve good heat dissipation effect

Active Publication Date: 2020-11-17
SHANGHAI JIAO TONG UNIV
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional industrial frequency transformers are large in size, weight and low in efficiency, and will generate a lot of losses when used in megawatt-level photovoltaic power generation systems. High-frequency transformers have the advantages of high power density and high efficiency, which can greatly improve the efficiency of the system
However, at the same time, the small volume and heat dissipation area of ​​high-frequency transformers face high insulation and heat dissipation pressure. Traditional air insulation and transformer oil insulation are difficult to balance heat dissipation and insulation effects, and the insulation structure is complex.
In addition, in the resonant soft switching circuit, an additional inductive magnetic element is required as a resonant component, which further increases the loss and volume of the system

Method used

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  • Cake type solid insulation high-frequency transformer based on 3D printing
  • Cake type solid insulation high-frequency transformer based on 3D printing
  • Cake type solid insulation high-frequency transformer based on 3D printing

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Embodiment Construction

[0038] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0039] refer to figure 1 As shown, it is a schematic structural diagram of a pie-type solid-insulated high-frequency transformer based on 3D printing in a preferred embodiment of the present invention, and the figure includes a winding mold shell and a magnetic core 44 .

[0040] combine figure 2 , image 3 and Figure 4 As shown, the winding mold shell includes the winding inner shell 11 , the secondary winding shell 22 and the winding shell 33 . As a preferred method, the winding inner shel...

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Abstract

The invention provides a cake-type solid insulation high-frequency transformer based on 3D printing, which is characterized in that a winding mold shell comprises a winding inner shell, a secondary winding shell and a winding outer shell, a primary winding is wound on the winding inner shell, a secondary winding is wound on the secondary winding shell, and the secondary winding shell is nested atone end of the winding inner shell to form an integrated structure; the primary side winding and the secondary side winding are of an upper-lower cake type winding structure; the winding shell is sleeved on the upper part of the integrated structure; a sealed space is formed between the primary winding, the secondary winding and the winding shell; the solid insulating material is loaded in the sealed space; the magnetic core is connected with the winding mold shell in an inserted mode, and the magnetic core is connected with the winding inner shell and the secondary winding shell in an inserted mode, so that the primary winding and the secondary winding sleeve the outer wall of the magnetic core. According to the invention, the matching problem of the leakage inductance and the main inductance in the resonant soft switching circuit is solved, the solid insulating material is difficult to apply, and the design goals of high power density, high efficiency and high insulating strength areachieved.

Description

technical field [0001] The invention relates to the field of solid-insulated high-frequency transformers, in particular to a solid-state transformer-oriented pie-type solid-insulated high-frequency transformer based on 3D printing. Background technique [0002] Traditional industrial frequency transformers are large in size, weight and low in efficiency, and will generate a lot of losses when used in megawatt-level photovoltaic power generation systems. High-frequency transformers have the advantages of high power density and high efficiency, which can greatly improve the efficiency of the system . But at the same time, the small volume and heat dissipation area of ​​high-frequency transformers face high insulation and heat dissipation pressure. Traditional air insulation and transformer oil insulation are difficult to balance heat dissipation and insulation effects, and the insulation structure is complex. In addition, in the resonant soft switching circuit, an additional ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F27/02H01F27/22H01F27/32H01F27/28H01F27/30H01F27/34B33Y80/00
CPCH01F27/02H01F27/22H01F27/324H01F27/2871H01F27/306H01F27/34B33Y80/00
Inventor 梁战谢宝昌李睿蔡旭
Owner SHANGHAI JIAO TONG UNIV
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