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A pie-type solid insulation high-frequency transformer based on 3D printing

A high-frequency transformer, solid insulation technology, applied in the direction of transformer/inductor cooling, transformer/inductor housing, transformer/inductor components, etc. Complex structure and other problems, to solve the problem of matching leakage inductance and main inductance, high power density and good heat dissipation effect

Active Publication Date: 2022-04-26
SHANGHAI JIAO TONG UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditional industrial frequency transformers are large in size, weight and low in efficiency, and will generate a lot of losses when used in megawatt-level photovoltaic power generation systems. High-frequency transformers have the advantages of high power density and high efficiency, which can greatly improve the efficiency of the system
However, at the same time, the small volume and heat dissipation area of ​​high-frequency transformers face high insulation and heat dissipation pressure. Traditional air insulation and transformer oil insulation are difficult to balance heat dissipation and insulation effects, and the insulation structure is complex.
In addition, in the resonant soft switching circuit, an additional inductive magnetic element is required as a resonant component, which further increases the loss and volume of the system

Method used

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  • A pie-type solid insulation high-frequency transformer based on 3D printing
  • A pie-type solid insulation high-frequency transformer based on 3D printing
  • A pie-type solid insulation high-frequency transformer based on 3D printing

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Embodiment Construction

[0038] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0039] refer to figure 1 As shown, it is a schematic structural diagram of a pie-type solid-insulated high-frequency transformer based on 3D printing in a preferred embodiment of the present invention, and the figure includes a winding mold shell and a magnetic core 44 .

[0040] combine figure 2 , image 3 and Figure 4 As shown, the winding mold shell includes the winding inner shell 11 , the secondary winding shell 22 and the winding shell 33 . As a preferred method, the winding inner shel...

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Abstract

The present invention provides a pie-type solid-insulation high-frequency transformer based on 3D printing, which includes: the winding mold shell includes a winding inner shell, a secondary winding shell and a winding shell, and the winding inner shell is wound with a primary winding and a secondary winding shell The upper winding is equipped with a secondary winding, and the secondary winding shell is nested in one end of the winding inner shell to form an integrated structure, so that the primary winding and the secondary winding form an upper and lower pie-shaped winding structure; the winding shell is placed on the integrated structure, and the primary winding A sealed space is formed between the winding, the secondary winding and the winding shell; solid insulating material is filled in the sealed space; the magnetic core is plugged into the winding mold shell, and the magnetic core is plugged into the winding inner shell and the secondary winding shell so that the primary side The winding and the secondary winding are sleeved on the outer wall of the magnetic core. The invention solves the matching problem of the leakage inductance and the main inductance in the resonant soft switching circuit, and the difficult application of solid insulating materials, and realizes the design goals of high power density, high efficiency and high insulation strength.

Description

technical field [0001] The invention relates to the field of solid-insulated high-frequency transformers, in particular to a solid-state transformer-oriented pie-type solid-insulated high-frequency transformer based on 3D printing. Background technique [0002] Traditional industrial frequency transformers are large in size, weight and low in efficiency, and will generate a lot of losses when used in megawatt-level photovoltaic power generation systems. High-frequency transformers have the advantages of high power density and high efficiency, which can greatly improve the efficiency of the system . But at the same time, the small volume and heat dissipation area of ​​high-frequency transformers face high insulation and heat dissipation pressure. Traditional air insulation and transformer oil insulation are difficult to balance heat dissipation and insulation effects, and the insulation structure is complex. In addition, in the resonant soft switching circuit, an additional ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/02H01F27/22H01F27/32H01F27/28H01F27/30H01F27/34B33Y80/00
CPCH01F27/02H01F27/22H01F27/324H01F27/2871H01F27/306H01F27/34B33Y80/00
Inventor 梁战谢宝昌李睿蔡旭
Owner SHANGHAI JIAO TONG UNIV
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