Unlock instant, AI-driven research and patent intelligence for your innovation.

LCP-based multi-layer rectangular micro coaxial radio frequency transmission line manufacturing method and transmission line

A technology of radio frequency transmission and manufacturing method, applied in the field of transmission lines, can solve the problems of preparing micro-coaxial radio frequency transmission devices without multi-layer LCP circuit boards, and achieve the advantages of reducing process difficulty, saving processing cost and cycle, and reducing the number of laminations. Effect

Active Publication Date: 2020-11-17
SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
View PDF2 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, there is no method for preparing a micro-coaxial radio frequency transmission device using a multi-layer LCP circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LCP-based multi-layer rectangular micro coaxial radio frequency transmission line manufacturing method and transmission line
  • LCP-based multi-layer rectangular micro coaxial radio frequency transmission line manufacturing method and transmission line
  • LCP-based multi-layer rectangular micro coaxial radio frequency transmission line manufacturing method and transmission line

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0040] figure 1 It is a flowchart of a method for manufacturing a multi-layer rectangular micro-coaxial radio frequency transmission line based on LCP in an embodiment of the present invention, such as figure 1 As shown, the LCP-based multilayer rectangular micro-coaxial radio frequency transmission line manufacturing method provided by the present invention comprises the following steps:

[0041] Step S1: performing photolithography on the multilayer LCP circuit board and then laminating to gene...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides an LCP-based multi-layer rectangular micro-coaxial radio frequency transmission line manufacturing method and a transmission line, and the method comprises the steps: carrying out the photoetching of a multi-layer LCP circuit board, carrying out the lamination to generate a target multi-layer LCP circuit board, enabling the upper surface of a first LCP circuit board in the target multi-layer LCP circuit board to be provided with a first metal region, and enabling the lower surface to be provided with a first metal layer; processing at least two grooves extending in the thickness direction of the target multilayer LCP circuit board, wherein the grooves extend to the first metal layer; taking the first metal layer as a cathode and the groove as a mold, and performing electroforming filling on the groove to the upper surface of the target multilayer LCP circuit board; cutting the target multilayer LCP circuit board between the two grooves and the first metal regionto form a support body and an inner cavity, wherein the support body is used for supporting the first metal region; and the other LCP circuit board is laminated after the inner cavity is sealed. The metal side wall is formed by filling electroformed copper after grooves are machined in the laminated multi-layer plate through laser, the laminating frequency is reduced, and the problem that the laminating period is long is solved.

Description

technical field [0001] The invention relates to the field of radio frequency microsystem manufacturing, in particular to an LCP-based multilayer rectangular micro-coaxial radio frequency transmission line manufacturing method and the transmission line. Background technique [0002] With the development of electronic products in the direction of thinner, lighter and multifunctional, high integration requirements are put forward for RF Microsystems (RF Microsystems). Traditional transmission lines such as coplanar waveguides, microstrip lines, and coaxial lines have been widely used in microwave systems, and have good transmission characteristics at low frequencies. However, as the frequency rises, the performance of the transmission line is greatly reduced due to problems such as the dielectric and radiation loss and the limitation of high-order modal excitation in the traditional planar transmission structure. The three-dimensional rectangular micro-coaxial transmission lin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01P11/00H05K3/46
CPCH01P11/001H05K3/4611H05K3/4697
Inventor 刘凯曹向荣郭芸希张诚丁蕾罗燕任卫朋王立春
Owner SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More