Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacturing method and transmission line of multilayer rectangular micro-coaxial radio frequency transmission line based on lcp

A technology of radio frequency transmission and manufacturing method, which is applied in the field of transmission lines, can solve the problems of preparing micro-coaxial radio frequency transmission devices without multi-layer LCP circuit boards, and achieve the goal of reducing process difficulty, reducing the number of laminations, and saving processing costs and cycles Effect

Active Publication Date: 2022-02-18
SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, there is no method for preparing a micro-coaxial radio frequency transmission device using a multi-layer LCP circuit board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method and transmission line of multilayer rectangular micro-coaxial radio frequency transmission line based on lcp
  • Manufacturing method and transmission line of multilayer rectangular micro-coaxial radio frequency transmission line based on lcp
  • Manufacturing method and transmission line of multilayer rectangular micro-coaxial radio frequency transmission line based on lcp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0040] figure 1 It is a flowchart of a method for manufacturing a multi-layer rectangular micro-coaxial radio frequency transmission line based on LCP in an embodiment of the present invention, such as figure 1 As shown, the LCP-based multilayer rectangular micro-coaxial radio frequency transmission line manufacturing method provided by the present invention comprises the following steps:

[0041] Step S1: performing photolithography on the multilayer LCP circuit board and then laminating to gene...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for manufacturing a multilayer rectangular micro-coaxial radio frequency transmission line based on LCP and the transmission line, comprising: performing photolithography on a multilayer LCP circuit board and then laminating to generate a target multilayer LCP circuit board, and the target multilayer LCP circuit board The upper surface of the first-layer LCP circuit board has a first metal region, and the lower surface has a first metal layer; at least two grooves extending along the thickness direction are processed for the target multilayer LCP circuit board, and the grooves extend to the first Metal layer; the first metal layer is used as a cathode, and the groove is used as a mould, and the groove is electroformed and filled to the upper surface of the target multilayer LCP circuit board; the target multilayer LCP between the two grooves and the first metal region The circuit board is cut to form a support body and an inner cavity, and the support is used to support the first metal region; another LCP circuit board is sealed to cover the inner cavity and then laminated. In the present invention, the metal side wall is formed by laser machining grooves of the laminated multi-layer board and filled with electroformed copper, which reduces the number of laminations and solves the problem of long lamination cycle.

Description

technical field [0001] The invention relates to the field of radio frequency microsystem manufacturing, in particular to an LCP-based multilayer rectangular micro-coaxial radio frequency transmission line manufacturing method and the transmission line. Background technique [0002] With the development of electronic products in the direction of thinner, lighter and multifunctional, high integration requirements are put forward for RF Microsystems (RF Microsystems). Traditional transmission lines such as coplanar waveguides, microstrip lines, and coaxial lines have been widely used in microwave systems, and have good transmission characteristics at low frequencies. However, as the frequency rises, the performance of the transmission line is greatly reduced due to problems such as the dielectric and radiation loss and the limitation of high-order modal excitation in the traditional planar transmission structure. The three-dimensional rectangular micro-coaxial transmission lin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01P11/00H05K3/46
CPCH01P11/001H05K3/4611H05K3/4697
Inventor 刘凯曹向荣郭芸希张诚丁蕾罗燕任卫朋王立春
Owner SHANGHAI SPACEFLIGHT ELECTRONICS & COMM EQUIP RES INST
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More