Full-band silicon microphone with #-shaped sound beam

Abstract

The invention discloses a full-band silicon microphone with a #-shaped sound beam. The full-band silicon microphone comprises a sensor, a sound cavity and a circuit board, the sensor comprises a vibrating diaphragm and a silicon back polar plate. A first groove and a second groove are formed in at least one side surface of the vibrating diaphragm, and the two grooves are crossed and communicated with each other to equally divide the surface of the vibrating diaphragm into four resonance regions; the diaphragm is also provided with a sound beam assembly at the center of the same side surface provided with the two grooves, and the sound beam assembly comprises a plurality of strip-shaped sound beam components which are arranged at two sides of the first groove and two sides of the second groove in pairs. And the two grooves respectively form audio tunnels on the surface of the vibrating diaphragm. According to the invention, the diaphragm is changed from a conventional free vibration mode to a current standard vibration mode, thereby solving a problem that the silicon microphone cannot effectively resonate full-band sound details from the aspects of vibration and resonance, enablingthe silicon microphone to achieve the effective resonance in a full band, and achieving a high-fidelity effect. Practice proves that the improved design scheme has outstanding substantive features andremarkable technical progress, and an obvious technical effect is achieved.

Description

technical field [0001] The invention relates to a silicon microphone, in particular to a full-frequency silicon microphone with a well-shaped sound beam. Background technique [0002] Silicon microphones, also known as MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) microphones, are microphones manufactured based on MEMS technology. Compared with ECM in terms of miniaturization, performance, reliability, environmental tolerance, cost and mass production capacity, it has quickly occupied the consumer electronics market such as mobile phones, earphones, PDAs, MP3s and hearing aids. [0003] A silicon microphone consists of a MEMS sensor, an ASIC chip, an acoustic cavity, and a circuit board with RF suppression circuitry. The MEMS sensor is a miniature capacitor composed of a diaphragm and a silicon back plate, which can convert the sound pressure change into a capacitance change, and then convert the capacitance change into an electrical signal by the ...

AI Technical Summary

Problems solved by technology

[0005] When the diaphragm of a silicon microphone receives sound waves from an external sound source, because it has an inherent resonant frequency, if it exceeds a certain range in the resonant frequency area, there will be problems that the high-pitched and low-pitched areas cannot resonate effectively, resulting in the sound received by it. After the sound is converted by "sound-to-electricity" and then restored by "electricity-to-sound", the sound quality has the problem that the high-pitched area is not bright, and the low-pitched area is not thick and round enough, which leads to poor fidelity of the sound

The main reason is that the current diaphragm cannot meet the good broadband vibration from the high-pitched range to the low-pitched range, that is, it cannot adapt to the resonance and vibration of the wide-ranging frequency changes in the high-pitched, mid-range, and low-pitched ranges at the same time, so when receiving sound Unable to collect all the sound details of the full frequency band

To sum up, the traditional silicon mic has an unreasonable structural design, which is not conducive to the good sound wave vibration of the diaphragm from the high-pitched range to the low-pitched range.

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