Full-band silicon microphone with sound beam and sound tunnels

Abstract

The invention discloses a full-band silicon microphone with a sound beam and sound tunnels. The full-band silicon microphone comprises a sensor, a sound cavity and a circuit board; the sensor comprises a vibrating diaphragm and a silicon back polar plate; a sound beam assembly is arranged on the vibrating diaphragm and comprises a plurality of arc-shaped sound beam components, the arc-shaped soundbeam components are arranged in a ring shape, and a gap is formed between every two adjacent arc-shaped sound beam components; an annular area and at least two radiation grooves are formed on the surface,which is provided with the sound beam assembly, of the vibrating diaphragm; the radiation grooves are uniformly arranged in a radial manner, and equally divide the surface of the vibrating diaphragm at the outer side of the sound beam assembly into a plurality of resonance areas; the radiation grooves and the gap between the two arc-shaped sound beam components are arranged in a one-to-one alignment and penetration manner, and the inner end of each radiation groove is communicated with the annular area; and the radiation grooves are concavely arranged on the surface of the vibrating diaphragm to form audio tunnels. According to the invention, the diaphragm is changed from a conventional free vibration mode to a conventional standard vibration mode, thereby solving a problem that the silicon microphone cannot effectively resonate full-band sound details from the aspects of vibration and resonance, enabling the silicon microphone to achieve the effective resonance in a full band, and achieving a high-fidelity effect.

Description

technical field [0001] The invention relates to a silicon microphone, in particular to a full-frequency silicon microphone with a sound beam and a sound tunnel. Background technique [0002] Silicon microphones, also known as MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) microphones, are microphones manufactured based on MEMS technology. Compared with ECM in terms of miniaturization, performance, reliability, environmental tolerance, cost and mass production capacity, it has quickly occupied the consumer electronics market such as mobile phones, earphones, PDAs, MP3s and hearing aids. [0003] A silicon microphone consists of a MEMS sensor, an ASIC chip, an acoustic cavity, and a circuit board with RF suppression circuitry. The MEMS sensor is a miniature capacitor composed of a diaphragm and a silicon back plate, which can convert the sound pressure change into a capacitance change, and then convert the capacitance change into an electrical signal ...

AI Technical Summary

Problems solved by technology

[0005] When the diaphragm of a silicon microphone receives sound waves from an external sound source, because it has an inherent resonant frequency, if it exceeds a certain range in the resonant frequency area, there will be problems that the high-pitched and low-pitched areas cannot resonate effectively, resulting in the sound received by it. After the sound is converted by "sound-to-electricity" and then restored by "electricity-to-sound", the sound quality has the problem that the high-pitched area is not bright, and the low-pitched area is not thick and round enough, which leads to poor fidelity of the sound

The main reason is that the current diaphragm cannot meet the good broadband vibration from the high-pitched range to the low-pitched range, that is, it cannot adapt to the resonance and vibration of the wide-ranging frequency changes in the high-pitched, mid-range, and low-pitched ranges at the same time, so when receiving sound Unable to collect all the sound details of the full frequency band

To sum up, the traditional silicon mic has an unreasonable structural design, which is not conducive to the good sound wave vibration of the diaphragm from the high-pitched range to the low-pitched range.

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