Connecting structure and sensor thereof

Abstract

The invention discloses a connecting structure and a sensor thereof, and relates to the technical field of sensors. The connecting structure comprises a first unit, a second unit and a third unit, anupper boss structure of the second unit is connected with the first unit in a clamped and matched mode, a lower boss structure of the second unit is connected with the third unit in a clamped and matched mode, and a connecting part of the second unit is provided with a hollowed-out structure. The invention further discloses an assembling method of the connecting structure. The connection operationamong the first unit, the second unit and the third unit is simple and effective, the problems of inaccurate alignment among the three units and / or excessive bonding materials are avoided, the yieldand the operation efficiency are improved, the usage amount of the bonding materials is reduced, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a connection structure and a sensor thereof. Background technique [0002] A sensor is a device or device that can sense what is being measured and convert it into a usable output signal according to certain rules, usually consisting of sensitive elements and conversion components. Among them, the sensitive element refers to the part of the sensor that can directly sense or respond to the measured; the conversion component refers to the part of the sensor that converts the measured change sensed or responded by the sensitive element into a signal suitable for transmission or measurement. [0003] Generally, according to the physical quantity measured by the sensor, it can be divided into displacement sensor, pressure sensor, acceleration sensor, temperature sensor and so on. The commonly referred to as a pressure sensor refers to a device or device that can sense fluid pressure ...

AI Technical Summary

Problems solved by technology

[0006] Problems in the prior art: 1. It is difficult to locate and align the ring gasket when it is bonded to the elastomer, which is time-consuming and easily leads to defective products; 2. It is difficult to locate and align the circuit board when it is bonded to the ring gasket. Time-consuming and easy to lead to defective products; 3. When the ring gasket is bonded to the elastomer, and / or the circuit board is bonded to the ring gasket, it is easy to cause the coated bonding material to overflow, which must be cleaned, and it is easy to remove Bringing it to other parts will cause pollution, and it will easily cause the displacement of the gasket and the circuit board when it is removed at the same time. It needs to be repositioned and aligned, which is time-consuming and likely to lead to defective products; 4. The ring gasket and the elastomer are bonded to a plane contact And the area is limited, which often leads to insufficient bonding strength and difficult control, high requirements for operators, low work efficiency, and waste of bonding materials; 5. The ring gasket is bonded to the elastomer, and the circuit board is bonded to the ring The gasket requires two independent coatings of bonding materials, which complicates the process and lengthens the working hours

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