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Module splicing type phased array transducer

A spliced, phased array technology, applied in the direction of printed circuits, printed circuits, and electrical equipment structural components connected by non-printed electrical components, can solve the problem of positioning and replacement of a single array element that cannot be damaged, and achieve Avoid long-term high temperature damage, reduce maintenance costs and prolong service life

Pending Publication Date: 2020-11-24
韶关东阳光自动化设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the shortcomings of the inability to locate and replace damaged single array elements in the above-mentioned prior art, the present invention provides a modular splicing phased array transducer that can realize precise positioning, real-time monitoring and easy replacement of a single array element

Method used

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  • Module splicing type phased array transducer
  • Module splicing type phased array transducer
  • Module splicing type phased array transducer

Examples

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Embodiment

[0030] Such as Figure 1 to Figure 8 It is an embodiment of a modular splicing phased array transducer, including a housing 1, a printed circuit board 2 disposed in the housing 1, a substrate 3, a transducer array 4, and a monitoring device; the printed circuit board 2 includes The positive electrode layer 21 and the negative electrode layer 22, the substrate 3 is fixedly covered on the negative electrode layer 22 of the printed circuit board 2, the substrate 3 is provided with a plurality of through holes 31, the transducer array 4 is covered on the substrate 3, and the transduction The transducer array 4 includes a plurality of transducer array elements 41, each transducer array element 41 includes a crystal 411, a positive pole pin 412, and a negative pole pin 413, and the positive pole pin 412 is connected to the positive electrode layer 21 through the through hole 31 , the negative pin 413 is electrically connected to the negative electrode layer 22 of the printed circuit...

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Abstract

The invention relates to the technical field of transducers and more particularly relates to a module splicing type phased array transducer. The module splicing type phased array transducer comprisesa shell, a printed circuit board arranged in the shell, a base plate, a transducer array and a monitoring device. The printed circuit board comprises a positive electrode layer and a negative electrode layer. The base plate is fixedly arranged on the negative electrode layer of the printed circuit board in a covering manner, and multiple through holes are formed in the base plate. The transducer array is arranged on the base plate in a covering manner and comprises multiple transducer array element. Each transducer array element comprises a crystal, a positive electrode lead and a negative electrode lead. The positive electrode leads penetrate the through holes to be connected with the positive electrode layer, the negative electrode leads penetrate the through holes to be electrically connected with the negative electrode layer, and the monitoring device is connected with the transducer array. The transducer array elements are detachably connected with the base plate through the through holes. By means of the module splicing type phased array transducer, the transducer array elements are directly inserted into the printed circuit board through the positive leads and the negative leads of the transducer array elements, the transducer array elements are directly pulled out from the circuit board when being damaged, and replacing of single transducer elements is achieved.

Description

technical field [0001] The invention relates to the technical field of transducers, in particular to a module splicing phased array transducer. Background technique [0002] Existing phased array transducers are manufactured at one time and packaged in a unified manner, and different numbers of array elements are mainly made for different needs. Its production efficiency advantage can only be reflected in mass production, but its production process has many processes, and if the overall performance cannot meet the working requirements due to the failure of local array elements, the entire transducer needs to be replaced, and the maintenance cost in the later period too high. [0003] In order to solve the above problems, Chinese patent CN201711386554.X provides a spliced ​​ultrasonic transducer and its manufacturing method, including at least two ultrasonic transducer modules, the ultrasonic transducer module includes a housing and a wafer arranged in the housing, the wafer...

Claims

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Application Information

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IPC IPC(8): B06B1/06H05K1/02H05K1/18H05K7/20
CPCB06B1/06H05K1/0268H05K1/181H05K7/20218H05K2201/10151
Inventor 陈功锦朱波王祥达何建方滕世国李建霖
Owner 韶关东阳光自动化设备有限公司
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