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High-precision wafer surface defect detection device and detection method thereof

A defect detection, high-precision technology, used in measuring devices, optical testing flaws/defects, material excitation analysis, etc., to improve luminous brightness, improve detection efficiency, and reduce false positives.

Active Publication Date: 2020-11-24
高视科技(苏州)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the defects introduced by the material itself or the processing technology, not all defects on the wafer can be revealed by a single light source

Method used

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  • High-precision wafer surface defect detection device and detection method thereof
  • High-precision wafer surface defect detection device and detection method thereof

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Experimental program
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Effect test

Embodiment 1

[0030] A kind of high-precision wafer surface defect detection device of this embodiment, such as figure 1 As shown, it includes: a combined light source 1, an imaging device 3 and a computer. The combined light source 1 includes a point light source 6, a ring light source 7 and a backlight 8. The lens installation of the imaging device 3 is provided with a high-precision coaxial lens 4 , the coaxial lens 4 is provided with a beam splitter 9, the beam splitter 9 can be a prism or a semi-transparent mirror, and one side of the coaxial lens 4 is provided with a light hole 5 perpendicular to its optical axis, The point light source 6 is connected to the coaxial lens 4 through the light hole 5, the ring light source 7 is arranged between the coaxial lens 4 and the wafer 2, and the center of the ring light source 7 and the center of the coaxial lens 4 Consistent, the light of the ring light source 7 all obliquely shoots inward at a certain angle to form a circular halo, and the cen...

Embodiment 2

[0036] This embodiment provides a high-precision wafer surface defect detection method, the high-precision wafer surface defect detection method is applied to a high-precision wafer surface defect detection device described in Embodiment 1, such as figure 2 shown, including the following steps:

[0037] S1: Provide a high-precision wafer surface defect detection device with a combined light source 1 and imaging device 3;

[0038] S2: Place the product with the wafer 2 on the detection place of the high-precision wafer surface defect detection device, and control the combined light source 1 to emit light, so that the light source illuminates the part that needs to be detected on the product;

[0039] S3: Control the imaging device 3 to obtain the image of the detection part of the product under the light emitted by the combined light source 1, and analyze and judge after the computer obtains the image;

[0040] S4: Move the product so that the light emitted by the combined li...

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Abstract

The invention discloses a high-precision wafer surface defect detection device and a detection method thereof, and relates to the technical field of wafer detection, the high-precision wafer surface defect detection device comprises a combined light source and an imaging device, the combined light source is used for switching different light sources to irradiate a wafer, and the imaging device isused for acquiring an image after the combined light source irradiates the wafer. Defects of the wafer are diversified. Wherein the defects include surface dirt, dislocation, scratches and the like; light sources need to be switched and controlled in the detection process, so that defects are more obvious; according to the invention, the combined light sources of different light sources can be switched to irradiate the wafer; a high-adaptability lighting mode is adopted for different defect structural forms, various defects are more obvious in actual imaging, then images are obtained through the imaging device to be used for analyzing and judging defect types, and high-precision detection of various wafer surface defects is achieved.

Description

technical field [0001] The invention relates to the technical field of wafer detection, in particular to a high-precision wafer surface defect detection device and a detection method thereof. Background technique [0002] With the rapid development of my country's semiconductor manufacturing level, the integration level of wafers is constantly increasing, and the stability and reliability of its process put forward higher requirements for semiconductor inspection technology. High-precision detection of wafer surface defects has become a key point in the process. important part. [0003] Early semiconductor optical inspection methods generally placed the wafer in a bright environment, and observed whether there were defects such as dust or dirt on the surface through manual visual inspection or random inspection. However, as the characteristic size of grains decreases, the size of defects also decreases accordingly. Simple detection methods obviously cannot meet the requireme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/95G01N21/956G01N21/88G01N21/63
CPCG01N21/9501G01N21/8806G01N21/8851G01N21/956G01N21/63G01N2021/8854
Inventor 邹伟金徐武建周波苏达顺付金宝
Owner 高视科技(苏州)股份有限公司
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