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Method of manufacturing semiconductor device, substrate processing device and recording medium

A technology for a substrate processing apparatus and a manufacturing method, which is applied in the manufacture of semiconductor/solid state devices, a cleaning method using gas flow, chemical instruments and methods, etc., can solve problems such as the reduction of the operation rate of the apparatus

Pending Publication Date: 2020-12-01
KOKUSA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, since these cleaning techniques are performed after the condition of the exhaust unit becomes abnormal, as a result, the operation rate of the unit may decrease due to the maintenance of the exhaust unit

Method used

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  • Method of manufacturing semiconductor device, substrate processing device and recording medium
  • Method of manufacturing semiconductor device, substrate processing device and recording medium
  • Method of manufacturing semiconductor device, substrate processing device and recording medium

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Experimental program
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Embodiment approach

[0031] Hereinafter, an embodiment of the present invention will be described.

[0032] (1) Configuration of the substrate processing device

[0033] refer to figure 1 and figure 2 , the configuration of the substrate processing apparatus 100 according to one embodiment of the present invention will be described.

[0034] Such as figure 1 As shown, the substrate processing apparatus 100 includes a housing 111 configured as a pressure-resistant container. An opening is opened in the front wall of the housing 111 to enable maintenance, and a pair of front maintenance doors 104 are provided in the opening as an entry mechanism for opening and closing the opening. A wafer cassette 110 containing a wafer (hereinafter also referred to as a substrate) 200 of silicon or the like is used as a carrier for transporting the wafer 200 to and from the housing 111 .

[0035] On the front wall of the housing 111 , a wafer cassette loading and unloading port is opened so as to communicate...

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PUM

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Abstract

The invention relates to a method of manufacturing a semiconductor device, a substrate processing device and a recording medium. Described herein is a technique capable of removing by-products beforethe by-products are deposited to an exhaust part. According to one aspect of the technique, the method includes processing a substrate while maintaining an inner pressure of a process chamber at a process pressure by adjusting a valve configured to adjust the inner pressure of the process chamber; changing the inner pressure of the process chamber from the process pressure to an atmospheric pressure; and supplying a predetermined gas to a downstream side of the valve to bypass the process chamber while performing atmospheric pressure maintaining.

Description

technical field [0001] The present invention relates to a manufacturing method of a semiconductor device, a substrate processing device and a recording medium. Background technique [0002] In the conventional process, the influence of the conductance of the exhaust pipe was not so great, but in the process related to large-area 3D devices in recent years, the improvement of the exhaust performance has been emphasized. [0003] For example, Patent Document 1 discloses a technique for cleaning an exhaust pipe by supplying a cleaning gas into an exhaust portion without passing through a processing chamber. In addition, Patent Document 2 discloses a configuration in which a cleaning process for removing the accumulated film thickness accumulated in the exhaust pipe is executed when the accumulated film thickness accumulated in the exhaust pipe reaches a threshold value. [0004] However, since these cleaning techniques are performed after the state of the exhaust unit becomes ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67017H01L21/02041H01L21/67253C23C16/52C23C16/4412C23C16/4405C23C16/4408B08B5/00B08B9/027B08B9/0328
Inventor 奥野正则四谷达也永户雅也米岛利彦
Owner KOKUSA ELECTRIC CO LTD