Processing die for zirconia ceramic mobile phone backboard

Abstract

The invention discloses a processing die for a zirconia ceramic mobile phone backboard. The processing die comprises a lower die and an upper die; a die groove is formed in the bottom of the upper die; a fixed groove is formed in the top of the lower die; a movable plate is installed in the fixed groove in a sliding mode; the top of the movable plate extends out of the fixed groove; four first sliding grooves are formed in the inner wall of the bottom of the fixed groove; every two first sliding grooves of the four first sliding grooves are symmetrical; supporting rods are slidably mounted inthe four first sliding grooves correspondingly; the top ends of the supporting rods extend out of the first sliding grooves; and the top ends of the four supporting rods are fixedly connected with thebottom of the movable plate. The processing die is reasonable in design and good in practicability, effectively buffers and damps impact force generated during die assembly of the lower die and the upper die, avoids the situation that the upper die and the lower die are damaged due to the impact force generated during long-term die assembly, prolongs the service life of the upper die and the lower die, can rapidly cool the lower die and ensures that working is smoothly carried out.

Description

Technical field [0001] The present invention relates to a technical field of electronic materials products, particularly as a zirconia ceramic phone backplane processing mold. Background technique [0002] Nowadays, with the rapid development of technology, use of mobile phones more and more common, people on the mobile phones have become more sophisticated, in which consumer demands for quality and appearance of the phone backplane have become more sophisticated, because the zirconia ceramics with good abrasion resistance, high hardness, heat resistance, penetration and so on, and thus subject to manufacturers of all ages. [0003] Retrieved, authorized announcement No. CN209682481U discloses a zirconia ceramic phone backplane processing mold, comprising upper and lower molds, the lower mold is provided with a first recess, a bottom surface of the recess is provided with a first boss, the boss is provided with a contact hole for the external power supply; bottom surface of said ...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a processing mold for the back plate of zirconia ceramic mobile phone, which solves the problem that the existing processing mold for the back plate of zirconia ceramic mobile phone cannot fit the upper mold and the lower mold in use. The impact force generated during the mold is effectively buffered, it is easy to cause the upper mold and the lower mold to be subjected to the impact force generated during the mold closing for a long time, resulting in a decrease in mold clamping accuracy, shortening the service life of the upper mold and the lower mold, and cooling the lower mold. The cooling effect is not good, the cooling speed is slow, and the problem of affecting work efficiency

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