Crystal single-line direction-adjusting cutting method

A cutting method and crystal technology, which can be applied in the direction of working accessories, fine working devices, stone processing equipment, etc., can solve the problems of complex crystal orientation operation and low efficiency of orientation adjustment, and achieve the effect of improving efficiency and saving enterprise costs

Inactive Publication Date: 2020-12-04
SHANXI SEMICORE CRYSTAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the problems of complex orientation adjustment operation and low efficiency of existing crystal orientation

Method used

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  • Crystal single-line direction-adjusting cutting method
  • Crystal single-line direction-adjusting cutting method
  • Crystal single-line direction-adjusting cutting method

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Embodiment Construction

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail in combination with the embodiments and accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. The technical solutions of the present invention will be described in detail below in conjunction with the embodiments and accompanying drawings, but the scope of protection is not limited thereto.

[0022] A silicon carbide crystal single-wire orientation cutting method, specifically comprising the following steps:

[0023] 1. Use a cylindrical grinder to round the silicon carbide ingot to the single crystal area, and round the crystal ingot to obtain a regular round crystal 1; the cylindrical grinder uses a diamond grinding wheel;

[0024] 2. If figure 1 As shown, use ...

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Abstract

The invention relates to a crystal single-line direction-adjusting cutting method, and belongs to the technical field of crystal material cutting, and aims to solve the problems that existing crystaldirection adjusting operation is complex, and is low in efficiency. The crystal single-line direction-adjusting cutting method comprises the following specific steps: measuring a reference surface ofa crystal; finding out a direction with a deflection angle being zero degree; testing a vertical angle of the direction; determining a crystal deflection angle alpha; vertically fixing the crystal inthe direction with the crystal deflection angle being zero degere on a cutting base; fastening the cutting base on a single-wire cutting device; enabling a cutting wire of the single-wire cutting device to cling to the crystal reference surface; rotating the crystal to a corresponding deflection angle alpha; cutting off a stub bar, then carrying out translation and tool setting, and cutting off the tail of the stub bar to obtain a diretion-adjusted crystal. Single-line orientation is carried out by determining the crystal deflection angle alpha and fixing the reference surface, the cutting angle is rapidly determined, the crystal direction adjusting efficiency can be effectively improved, meanwhile, the redundant part of the crystal is effectively recycled, and the enterprise cost is saved.

Description

technical field [0001] The invention belongs to the technical field of crystal material cutting, and in particular relates to a crystal single-line direction-adjusting cutting method. Background technique [0002] Crystal cutting technology is an important process in the crystal processing process. In the crystal cutting process, there will be crystal orientation requirements. Due to the various characteristics of crystals, people have different crystal orientation precision requirements for the use of various crystals, and different crystal planes have different hardness, elastic modulus and fracture strength during the cutting process, and the thickness difference and Warpage rates also vary considerably. The existing cutting equipment does not have a crystal orientation detection device. In the process of processing, a wafer needs to be cut first, and after the offline crystal orientation angle test is performed, the crystal orientation on the cutting equipment is readju...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/04B28D7/00
CPCB28D5/0064B28D5/045
Inventor 靳霄曦张继光徐伟魏汝省赵丽霞李斌樊晓
Owner SHANXI SEMICORE CRYSTAL CO LTD
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