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Material placing device and packaging equipment

A technology of discharging device and driving device, applied in the directions of packaging, transportation and packaging, conveyor objects, etc., can solve the problems of inability to separate water, PCB board is corroded by water, PCB board is easily corroded, etc., to prevent water vapor corrosion. Effect

Pending Publication Date: 2020-12-04
SHENZHEN DEXIN AUTOMATION EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, vacuuming cannot completely remove the moisture, and the film cannot completely block the moisture. The PCB board after vacuum packaging still has the risk of being corroded by moisture. In order to prevent the PCB board from being corroded, it will be placed next to the PCB board. agent
[0003] At present, the placement position of the desiccant is low, which often leads to the separation of the desiccant from the PCB board, the desiccant cannot function normally, and the PCB board is easily corroded

Method used

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  • Material placing device and packaging equipment
  • Material placing device and packaging equipment
  • Material placing device and packaging equipment

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Embodiment Construction

[0024] The conception and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention.

[0025] In the description of the embodiments of the present invention, if it involves orientation description, for example, the orientation or positional relationship indicated by "upper", "lower", "front", "back", "left", "right" etc. is based on the drawings The orientations or positional relationships shown are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply t...

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Abstract

The invention discloses a material placing device and packaging equipment. The material placing device comprises a rack and a first material placing assembly, a carrying platform is arranged on the rack, and the carrying platform can bear a first material; and the first material placing assembly comprises a first driving device, a second driving device, a third driving device and a first materialtaking head, the first material taking head can grab or release a second material, the first driving device can drive the first material taking head to move in the X-axis direction and the Z-axis direction, the second driving device can drive the first material taking head to move in the Y-axis direction, and the third driving device can drive the first material taking head to rotate around the axis on the XZ plane. According to the material placing device and the packaging equipment, a drying agent can tightly abut against stacked PCBs, the drying agent cannot be separated from the PCBs, andtherefore, the drying effect is good.

Description

technical field [0001] The invention relates to the technical field of PCB packaging, in particular to a discharging device and packaging equipment. Background technique [0002] In the packaging process of PCB boards, the stacked PCB boards are first placed on a film, then covered with another film, and finally the air between the two films is extracted, so as to realize the vacuum packaging of the PCB board and prevent the PCB board from Oxidation corrosion by air. However, vacuuming cannot completely remove the moisture, and the film cannot completely block the moisture. The PCB board after vacuum packaging still has the risk of being corroded by moisture. In order to prevent the PCB board from being corroded, it will be placed next to the PCB board. agent. [0003] At present, the placement position of the desiccant is low, which often causes the desiccant to be separated from the PCB board, the desiccant cannot function normally, and the PCB board is easily corroded. ...

Claims

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Application Information

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IPC IPC(8): B65B61/20B65G47/90
CPCB65B61/20B65G47/902
Inventor 李金生涂昊
Owner SHENZHEN DEXIN AUTOMATION EQUIP
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