Stamp hole module RF test pad layout structure and its RF test fixture

Abstract

The invention discloses a layout structure of a stamp hole module radio frequency test PAD and a radio frequency test fixture. The board edge of the stamp hole module has a board edge PIN, and the stamp hole module includes a radio frequency antenna PIN serving as an antenna radio frequency test point, and a ground PAD pad. The A end of the RF antenna PIN is located at the edge of the board, and the B end is located in the center of the ground PAD pad. The ground PAD pad is a cutting ring pad. Test pin, test pin board cover; RF test pin includes outer ring shielding PAD, which is used for electrical connection with the ground PAD pad, and matches the shape of the ground PAD pad; the test pin board cover is used to fix and limit the RF test pin . The invention reduces the length of the radio frequency wiring by passing the distance between the radio frequency test point PAD and the radio frequency antenna PAD, improves the radio frequency performance, and avoids waste in production. At the same time, the RF test pin is in contact with the ground PAD pad after metal cutting to obtain the RF test fixture.

Description

technical field [0001] The invention relates to the technical field of application terminals in the communication module industry, in particular to a radio frequency test PAD layout structure of a stamp hole module and a radio frequency test fixture thereof. Background technique [0002] At present, in the production of all stamp hole communication modules, the radio frequency needs to be pre-calibrated. The PAD at the bottom of the module is generally reserved for radio frequency test points, which are connected to the radio frequency test pins on the production fixture for calibration and comprehensive testing. The central test point of the RF test pin is connected to the RF antenna PIN on the module, and a circle of metal shielding PAD around the RF test pin is connected to the ground PAD around the antenna PIN on the module to maintain good RF performance. [0003] However, for the existing RF test pin structure, there are two common methods for the layout of the PAD at ...

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Problems solved by technology

[0003] However, for the existing RF test pin structure, there are two common methods for the layout of the PAD at the bottom of the module: the first layout method discards the module PIN, and sets the center point of the PIN on the RF antenna pad of the module as the center, and sets around it. A circle of PAD pads is in contact with the shielding PAD of the outer ring of the test pin. The disadvantage is that the two module PINs around the center point of the RF antenna pad PIN of the module will be discarded, causing some waste; the second type of center test Point extension layout method, on the basis of method 1, the RF calibration antenna test point is moved up, and with this test point as the center, a circle of ground PAD pads is set around it, which is in contact with the outer ring shielding PAD of the test pin , although it will not occupy the space of the PIN pin, its disadvantage is that there will be a period of antenna tail difference in the formal application of the module, which will slightly affect the RF performance

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