Processing method of super-thick special-shaped reinforcing sheet of flexible circuit

Abstract

The invention discloses a method for processing a super-thick special-shaped reinforcing sheet of a flexible circuit. The method comprises the following steps of: A, cutting a reinforcing sheet raw material into small reinforcing sheets, and milling grooves and / or milling holes including functional holes and positioning holes on the cut reinforcing sheets by using a slot cutter according to designrequirements, wherein the reinforcing sheet comprises a reinforcing base layer, an adhesive layer and a release paper layer, the thickness of the reinforcing base layer is greater than or equal to 0.35 mm, and the thickness is defined as an ultra-thick reinforcing sheet; B, removing the release paper layer, and adhering the reinforcing base layer with the release paper layer removed to a PET sheet, wherein the PET base material layer of the PET sheet is coated with an acrylic acid adhesive layer, and an acrylic acid adhesive layer blank which is not bonded with the reinforcing base layer is reserved on part of the PET base material layer; and D, bonding the PET sheets bonded with the reinforcing base layer to a rolled protective film one by one according to a set rule, wherein the protective film is bonded to the blank of the acrylic acid adhesive layer, and the adhesive PET bearing single sheet and the reinforcing sheet are combined in a crossed mode, so that the purpose of automaticroll material bonding is achieved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board processing, in particular to a processing method for an ultra-thick special-shaped reinforcing sheet of a flexible circuit. Background technique [0002] Flexible printed circuit (Flexible Printed Circuit, FPC), also known as flexible printed circuit, has been widely used for its light weight, thin thickness, free bending and folding and other excellent characteristics. [0003] As the thickness of flexible circuit boards becomes thinner, the quality requirements for products continue to increase. Parts of the product need to be reinforced, and the thickness of the reinforced parts is also increasing. For special-shaped reinforcement sheets with a thickness greater than 0.35mm with small holes and slots, the material of the reinforcement sheet can be polyimide PI, glass cloth substrate FR4 or other materials, which will exist in the thick reinforcement sheet during the FPC manufactu...

AI Technical Summary

Problems solved by technology

For special-shaped reinforcement sheets with a thickness greater than 0.35mm with small holes and slots, the material of the reinforcement sheet can be polyimide PI, glass cloth substrate FR4 or other materials, which will exist in the thick reinforcement sheet during the FPC manufacturing process. Various problems, in the end, only a single PCS can be manually laminated, and the lamination progress and efficiency cannot be guaranteed during mass production

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