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Method for avoiding blockage of holes in BGA area

A technology to avoid clogging and areas, applied in the processing of insulating substrates/layers, the formation of electrical connections of printed components, electrical components, etc., can solve the problem of green oil entering the hole, so as to prevent the problem of green oil entering the hole and solve the problem of green oil The effect of the access problem

Inactive Publication Date: 2020-12-04
东莞森玛仕格里菲电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the solder mask manufacturing process, there is a problem of green oil entering the hole in the BGA area

Method used

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  • Method for avoiding blockage of holes in BGA area
  • Method for avoiding blockage of holes in BGA area
  • Method for avoiding blockage of holes in BGA area

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Embodiment Construction

[0013] In order to facilitate the understanding of those skilled in the art, the present invention will be further described in detail below in conjunction with specific embodiments.

[0014] Such as figure 1 As shown, in the production process of the prior art, the green oil layer 3 is directly coated on the circuit board 1, and the green oil will penetrate into the holes and form a blockage, which does not meet the needs of customers.

[0015] Such as figure 2 , image 3 As shown, a method for avoiding hole clogging in the BGA area. After the outer layer of the circuit board 1 is etched, an automatic optical inspection is performed on the holes that need to be prevented from clogging, and the position of the hole 10 is determined. There is an electroplating layer 2 on the hole. The surface is treated with dry film, and the dry film 4 is covered outside the hole; during the solder mask silk screen printing process, the hole that needs to be blocked is covered with a dry fi...

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Abstract

The invention relates to a method for avoiding blockage of holes in a BGA area, which comprises the following steps of after etching the outer layer of a circuit board, carrying out automatic opticalinspection on the holes needing to be prevented from being blocked, and determining the positions of the holes, performing dry film processing on the outer layer, in the solder resist screen printingprocess, conducting dry film hole covering on holes needing to be prevented from being blocked, and finally, conducting solder mask exposure, development and film stripping, and keeping the hole unblocked after the dry film is removed. The method for avoiding blockage of holes in the BGA area has the advantages of being rapid, efficient, simple and the like.

Description

technical field [0001] The invention relates to a circuit board, in particular to a method for avoiding hole blockage in a BGA area. Background technique [0002] In the prior art, there is a method of using resin plug holes or green oil plug holes. The process of using resin plug holes in PCB is often because of BGA parts, because the traditional BGA may make VIA between the pad and the pad to route to the back, but if the BGA is too dense and the VIA cannot go out, you can directly drill the hole from the pad Make vias to other layers to route the wires, and then fill the holes with resin and plate copper to form a PAD, which is commonly known as the VIP process (viainpad). If you just make vias on the PAD without using resin to plug the holes, it is easy to cause leakage. Tin causes short circuits on the backside and empty soldering on the front side. [0003] The process of PCB resin plugging includes drilling, electroplating, plugging, baking, and grinding. After dril...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/12H05K3/40
CPCH05K3/0008H05K3/0055H05K3/0088H05K3/0094H05K3/1216H05K3/4038
Inventor 刘慧民厉志坚陈龙
Owner 东莞森玛仕格里菲电路有限公司