Wafer visual inspection equipment with removing structure and for semiconductor production

Abstract

The invention discloses wafer visual inspection equipment with a removing structure and for semiconductor production. The equipment comprises a frame, wherein a feeding box is arranged on the left side of the lower part in the frame, a first connecting plate is welded above a sucker, a first connecting rod is screwed below a first lock pin, a third lock pin is screwed on the right side of the first connecting plate, and a fourth lock pin is screwed below a second connecting rod. According to the wafer visual inspection equipment with the removing structure and for semiconductor production, compared with existing common visual inspection equipment, a marking block is arranged, an air cylinder drives a fifth connecting rod to move through an air rod, and the fifth connecting rod is in an arcshape, so that the moving range of the fifth connecting rod is reduced; and the fifth connecting rod drives the marking block on a rotating rod to do circular motion with a seventh lock pin on the right side of a sixth connecting rod as the circle center through a tenth lock pin, marking removing operation is conducted, the sixth connecting rod can reduce the rotating radius of the rotating rod,and the marking removing efficiency of the equipment is improved.

Description

technical field [0001] The invention relates to the technical field of wafer visual detection, in particular to a wafer visual detection device with a rejecting structure for semiconductor production. Background technique [0002] With the progress of society, the development of economy, and the continuous improvement of science and technology, semiconductors are the last to enter every household. Home appliances, digital products, electronic products, etc. are inseparable from semiconductors. During the production of semiconductors, semiconductor wafers need to be processed. Visual inspection, the performance of the semiconductor can only be guaranteed after passing the visual inspection of the wafer. The current wafer visual inspection equipment cannot perform marking and removal operations on the inspected wafers, which cannot well meet people's needs. In view of the above situation, technological innovation is carried out on the basis of existing visual inspection equipm...

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Problems solved by technology

[0003] The object of the present invention is to provide a wafer visual inspection device with a rejecting structure for semiconductor production, to solve the general problem in the background art that the detected wafer cannot be marked and removed, which cannot satisfy people's needs. demand problem

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