Method for improving test accuracy of test frame

Abstract

The invention belongs to the technical field of circuit board processing, and provides a method for improving the test accuracy of a test frame, which is realized through the following parameter control: controlling of test needle seed needle point selection; selecting a pipe position needle; and controlling the flatness of the test frame panel. The control of the test needle seed needle point selection specifically comprises the following steps: selecting a solder mask windowing PAD center by using a seed needle with a needle scattering slope of less than 300mil, properly deviating the seed needle at the BGA position with the needle scattering slope of more than 300mil, and just deviating and pricking to the central position of the solder mask windowing PAD during the test. According to the method, by controlling the position of the seed needle selected by the test needle, the selection of the pipe position needle and the flatness control of the panel, the deviation between the needleinserting position and the seed needle position during the test of the test frame is avoided, and the PCB does not swing or deviate during the test of the test frame. According to the method, the needle inserting precision of the test frame can be effectively improved, the test frame debugging time of testers is reduced, and the test one-time passing rate and the production efficiency are improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for improving the test accuracy of a test stand. Background technique [0002] With the rapid development of the electronic product industry, the update speed of electronic products is changing with each passing day, and the demand for corresponding PCB production capacity has also increased sharply. At present, due to the problem of the test accuracy of the test frame during the electronic test production of our company, the test needle is biased and the pass rate of the test is one time. Not high, affecting production efficiency and capacity output. How to improve the test accuracy of test racks and improve production efficiency has always been an important problem to be solved in the industry. [0003] In the prior art, the configuration density of the general testing machine is four times dense (50mil), the test frame structure is a 12-l...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the configuration density of the general testing machine is four times dense (50mil), the test frame structure is a 12-layer test frame, the test frame height is 93mm, and the test needle length is 95.25mm. When making test data, it is necessary to place needles in the high-density BGA position The slope will exceed 300mil. If the slope is large, the leakage length of the test pin will be short. During the test, it will often happen that the pad will not be able to reach the pad, resulting in a low test pass rate and affecting production efficiency.