Integrated PCB-level melt-blown electret power supply topology

A technology of PCB board and melt-blown cloth, which is applied in the direction of electrical components, adjusting electrical variables, and high-efficiency power electronic conversion, etc., can solve the problems of difficult reduction in weight and volume of electret power supplies, low power density, unfavorable overall circuit design, etc., to achieve The effects of improving integration and power density, reducing volume, and simplifying production difficulty

Inactive Publication Date: 2020-12-08
NANTONG UNIVERSITY
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the discrete circuit combined with the inverter circuit and the high-voltage package used in the traditional meltblown cloth electret power supply is not conducive to the overall design of the circuit, and it also makes it difficult to reduce the weight and volume of the electret power supply, and the power density is low.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Integrated PCB-level melt-blown electret power supply topology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an integrated PCB-level melt-blown electret power supply topology, and the electret power supply does not need an additional high-voltage pack and directly realizes the function of the high-voltage pack on a PCB by using a boosting transformer and a high-voltage uncontrolled rectifier bridge. The melt-blown cloth electret power supply topology comprises the following components: an alternating current power supply Va, a first filter capacitor C1, a second filter capacitor C2, a first voltage-sharing resistor R1, a second voltage-sharing resistor R2, a resonant inductorLr, a resonant capacitor Cr, a board boost transformer T, a first switch tube MOSFET M1, a second switch tube MOSFET M2 and a plurality of diodes. Compared with the traditional melt-blown cloth electret power supply, the integrated PCB-level melt-blown electret power supply topology does not need the additional high- voltage pack, and all elements are integrated on the PCB, so that the productiondifficulty is simplified, the size of the power supply is reduced, and the integration level and the power density are improved.

Description

technical field [0001] The invention relates to the technical field of electret power supply for melt-blown cloth, in particular to an integrated PCB board-level melt-blown cloth electret power supply topology. Background technique [0002] High-pressure electret treatment technology is the core technology to improve the virus adsorption effect of melt-blown cloth and meet the N95 standard. The shortage of high-pressure equipment and the uneven performance are the key factors restricting the quality and output of masks. However, the discrete circuit combined with the inverter circuit and the high-voltage package used in the traditional melt-blown cloth electret power supply is not conducive to the overall design of the circuit, and it also makes it difficult to reduce the weight and volume of the electret power supply, and the power density is low. For this reason, the present invention proposes an integrated board-level melt-blown cloth electret power supply, which uses a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/06H02M3/335
CPCH02M3/33569H02M7/06Y02B70/10
Inventor 张雷周玲玲姚子豪郑一专高嘉洛孙艺鹤陈礼先戴腾飞
Owner NANTONG UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap