Polishing pad trimmer, polishing equipment and method

A polishing pad and dresser technology, which is applied in the direction of grinding/polishing equipment, metal processing equipment, abrasive surface adjustment devices, etc., can solve the problem that brush type and diamond type dresser can be used at the same time or alternately, and can not achieve cleaning And other problems, to achieve the effect of improving the polishing effect, good cleanliness, and improving polishing efficiency

Inactive Publication Date: 2020-12-15
ZING SEMICON CORP
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a polishing pad dresser, polishing equipment and method, which is used to solve the problem that the existing polishing equipment is only equipped with a single type of dresser, and cannot realize brush type and polishing. Simultaneous use or alternate use of diamond-shaped dressers lead to many changes in use, and it is impossible to achieve both cleaning and roughness improvement.

Method used

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  • Polishing pad trimmer, polishing equipment and method
  • Polishing pad trimmer, polishing equipment and method
  • Polishing pad trimmer, polishing equipment and method

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Embodiment Construction

[0027] The embodiments of the present invention are described below by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0028] see Figure 1 to Figure 4 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification, so as to be understood and read by those who are familiar with the technology, and are not used to limit the implementation of the present invention. Restricted conditions, it does not have technical substantive significance, any structural modification, proportional relationship change or size adjustment, without affecting the effect that the present invention can produce and the purpose that can be achieved, should still fall within the present invention. The scope of the disclosed technical content can be cove...

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Abstract

The invention provides a polishing pad trimmer, polishing equipment and a method. The polishing pad trimmer comprises a driving device, a mounting base plate, a diamond trimming head, a brush, an elastic connecting piece and a controller, wherein the mounting base plate comprises a first surface, the diamond trimming head is arranged on the first surface of the mounting base plate, and the brush is arranged on the first surface of the mounting base plate through the elastic connecting piece; and the driving device is connected with the mounting base plate and the controller and is used for applying pressure to the mounting base plate under the control of the controller, and the expansion degree of the elastic connecting piece is changed along with the change of the pressure, so that the height of the brush relative to the diamond trimming head is changed, and different trimming purposes are achieved. By the adoption of the polishing pad trimmer, in the polishing operation process, thediamond trimming head or the brush can be flexibly switched as required, the polishing effect is improved, and the polishing efficiency is improved.

Description

technical field [0001] The invention relates to the field of silicon wafer preparation, in particular to a polishing pad dresser, polishing equipment and a method. Background technique [0002] Pad conditioner / Dresser is a device used to improve the surface condition of polishing pads in the silicon wafer polishing process. At present, there are mainly two types of polishing pad conditioners: brush type and diamond type. The brush type mainly plays the role of cleaning the polishing pad. It has less wear and consumption of the polishing pad, and has less influence on the uniformity of the polishing process. It is mainly used for soft polishing pads; the diamond type mainly plays the role of improving the roughness of the polishing pad. It also has a certain cleaning effect. It has a relatively large wear and tear on the polishing pad, and has a relatively large impact on the uniformity of the polishing process. It is mainly used for hard polishing pads. [0003] However, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017
CPCB24B53/017
Inventor 沙酋鹤
Owner ZING SEMICON CORP
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