Temperature control device and method, and integrated circuit manufacturing equipment

Abstract

The embodiment of the invention provides a temperature control device and method, and integrated circuit manufacturing equipment, and relates to the field of temperature control equipment. The temperature control method comprises the following steps: collecting a current temperature value PV of detected equipment; comparing the current temperature value PV with a preset temperature value SP to obtain a temperature difference value; carrying out refrigerating PID calculation and heating PID calculation on the temperature difference value to obtain a refrigerating control output value Cout1 anda heating control output value Hout1; and analyzing the heating control output value Hout1, and controlling a heating system and a refrigerating system to control the temperature of the detected equipment according to an analysis result so as to reach the preset temperature value SP. Through the simultaneous action of heating PID control and refrigeration PID control, the temperature control capability is enhanced, the temperature control precision of the equipment is greatly improved, and the temperature control precision in a no-load state is within + / -0.1 DEG C, and the temperature controlprecision in a loading state is within + / -0.5 DEG C.

Description

technical field [0001] The invention relates to the field of temperature control equipment systems, in particular to a temperature control device, integrated circuit manufacturing equipment and a method. Background technique [0002] Semiconductor temperature control device is an important equipment in the manufacturing process of semiconductor integrated circuit IC. In the etching process of integrated circuit IC manufacturing, it is required to maintain a constant temperature output to control the process chamber of the etching equipment, and the temperature control accuracy is high. In actual use, the semiconductor temperature control device controls the temperature precisely through the cooling and heating links. The current semiconductor temperature control device adopts the traditional PID control algorithm to achieve the same control target temperature and given temperature. It is difficult to guarantee the temperature control accuracy of the semiconductor temperature...

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Problems solved by technology

[0003] Embodiments of the present invention provide a temperature control device and a temperature control method to solve the problem of low temperature control accuracy in existing temperature control devices

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