A substrate table and a method for adjusting the stability of a microwave plasma sphere
A microwave plasma and plasma technology, applied in the direction of circuits, discharge tubes, electrical components, etc., can solve the problem of difficult adjustment of metal baffles
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Embodiment 1
[0016] Place a monocrystalline silicon wafer with a diameter of 50mm and a thickness of 8.0mm on the substrate table, adjust the positions of the three screws and the metal baffle, and the vacuum system will reduce the pressure in the vacuum chamber to 0.6KPa, and then inject H 2 , H 2 The flow rate is 100sccm (sccm: standard cubic centimeter per minute); the microwave source is turned on, and the microwave input is gradually increased from 500W. When the microwave input power reaches 800W, plasma is generated on the surface of the silicon wafer. Within 5 minutes, the air pressure in the vacuum chamber was increased from 0.6KPa to 4.0KPa, and the microwave power was gradually increased from 500W to 2.0KW. It can be seen that the plasma ball is stably suspended on the upper surface of the silicon substrate material. It shows that the plasma is stable at this time. Then turn off the microwave system, and take out the absorbent cotton after the silicon substrate material is full...
Embodiment 2
[0018] Fix the adjusted metal baffle and the three-screw adjuster in Example 1, replace the silicon substrate material in Example 1 with metal tungsten of the same size, and keep other conditions unchanged. The vacuum system reduces the air pressure in the vacuum chamber to 0.6KPa, and then injects H 2 , H 2 The flow rate is 100sccm; the microwave source is turned on, and the microwave input is gradually increased from 500W. When the microwave input power reaches 900W, plasma is generated on the surface of metal tungsten. Within 5 minutes, the air pressure in the vacuum chamber was increased from 0.6KPa to 4.0KPa, and the microwave power was gradually increased from 500W to 2.0KW. It can be seen that the plasma ball is stably suspended on the upper surface of the silicon substrate material. It shows that the plasma is stable at this time. Then turn off the microwave system, and take out the absorbent cotton after the tungsten substrate material is fully cooled. It is found t...
Embodiment 3
[0020] Fix the adjusted metal baffle and the three-screw adjuster in Example 1. Replace the silicon substrate material in Example 1 with metal tungsten of the same size, and place a metal reflective ring on the metal baffle. The metal reflective ring The specific dimensions are: inner diameter 15.1 mm; outer diameter 50.0 mm; height 15.0 mm; a complete metal ring formed by merging two symmetrical half rings around the metal support of the substrate table, made of stainless steel. Other conditions remain unchanged. The vacuum system reduces the air pressure in the vacuum chamber to 0.6KPa, and then injects H 2 , H 2 The flow rate is 100sccm; the microwave source is turned on, and the microwave input is gradually increased from 500W. When the microwave input power reaches 820W, plasma is generated on the surface of metal tungsten. Within 5 minutes, the air pressure in the vacuum chamber was increased from 0.6KPa to 4.0KPa, and the microwave power was gradually increased from 5...
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