Supercharge Your Innovation With Domain-Expert AI Agents!

Dustproof and moistureproof slot for computer hardware

A computer hardware and slot technology, applied in contact parts, electrical components, parts of connecting devices, etc., can solve the problems of shortening the service life of the device, affecting the connection of equipment, poor contact, etc., and improving the performance of dust and moisture resistance, The effect of avoiding corrosion damage and prolonging the service life

Inactive Publication Date: 2020-12-18
HUNAN UNIV OF SCI & ENG
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional slots are only set with open slots to expose the internal circuit components of the slot to the external environment. Since the computer case is in an open atmospheric exposure environment and the use conditions are not good, the dust in the air will gradually settle and adsorb on the case. Inside, especially the springs in the slots and the gold fingers of expansion devices such as display cards and network cards tend to accumulate dust, which will affect the connection of the device and cause poor contact, causing the computer to crash, blue screen or even fail to start. The slot is dust-proof and moisture-proof, which greatly shortens the service life of the device

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Dustproof and moistureproof slot for computer hardware
  • Dustproof and moistureproof slot for computer hardware
  • Dustproof and moistureproof slot for computer hardware

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0032] as attached Figure 1-8A dust-proof and moisture-proof slot for computer hardware as shown includes a host backplane 1, and the left and right sides of the top surface of the host backplane 1 are inlaid and installed with a first heat dissipation assembly 2 and a second heat dissipation assembly 3. The first heat dissipation assembly 2 and the second heat dissipation assembly 3 are installed. The top surface of the heat dissipa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a dustproof and moistureproof slot for computer hardware, which particularly relates to the technical field of computer slots. The dustproof and moistureproof slot comprises ahost backboard, a first heat dissipation assembly and a second heat dissipation assembly are embedded in the left side and the right side of the top surface of the host backboard respectively, and a first ventilation window is formed in the top surface of the first heat dissipation assembly; and a second ventilation window is formed in the top surface of the second heat dissipation assembly, and aclosed slot is embedded in the middle of the top surface of the host backboard. By arranging the closed slot and adopting a novel mainframe box slot closed structure, a clamping groove formed in theclosed slot is in friction connection with an isolation dust blocking plate, and an elastic piece is matched with a limiting connecting groove, so that a pushing spring applies directional pushing force to the isolation dust blocking plate through a positioning rod and a limiting plate; therefore, the two isolation dust blocking plates form a closed whole through the closed clamping cushion blocks, and the mainframe box slot is separated from the external environment to form a closed state.

Description

technical field [0001] The present invention relates to the technical field of computer sockets, and more particularly, the present invention relates to a dust-proof and moisture-proof socket for computer hardware. Background technique [0002] At present, computers have been widely used in all walks of life and households. Computer products have good scalability because their motherboards have several expansion slots for connecting graphics cards, network cards and other expansion devices. Common ones include PCI slot, AGP slot and USB slot. [0003] Traditional slots are only set with open slots, exposing the internal circuit components of the slot to the external environment. Since the computer case is in an open atmosphere exposure environment and the use conditions are poor, the dust in the air will gradually settle and be adsorbed on the case. The inside, especially the spring sheet in the slot and the touch sheet of the expansion device such as the display card and t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/52H01R13/10H01R13/639H05K7/20
CPCH01R13/10H01R13/5219H01R13/639H05K7/2039
Inventor 段华斌杨环俊邓永清杨杰尹向东
Owner HUNAN UNIV OF SCI & ENG
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More