Processing method for increasing binding strength of reinforcing filmof flexible circuit board
A technology of flexible circuit boards and reinforcing films, which is applied to laminated printed circuit boards, circuit bendable/stretchable parts, printed circuits, etc., can solve problems such as shedding and quality impact of flexible circuit boards, and achieve increased The effect of binding strength
Pending Publication Date: 2020-12-18
广州源康精密电子股份有限公司
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Problems solved by technology
At present, the reinforcing film tends to fall off from the cover film of the flexible circuit board due to the strengthening of the bonding force, which has a certain impact on the quality of the flexible circuit board
Method used
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[0023] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0024] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes ...
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The invention discloses a processing method for increasing the bonding strength of a reinforcing film of a flexible circuit board. The processing method comprises the following steps: S1, preparing the flexible circuit board to be pasted with the reinforcing film and a cover film; S2, performing alkaline cleaning on one surface, to be pasted with the reinforcing film, of the flexible circuit boardin the step S1; S3, drying the flexible circuit board after alkaline cleaning; S4, attaching the reinforcing film to the surface, to be attached with the film, of the dried flexible circuit board; and step S5, laminating a reinforcing film attached in the step S4. According to the processing method for increasing the binding strength of the reinforcing film of the flexible circuit board, the binding force of the reinforcing film and the cover film of the flexible circuit board can be increased, and the peel strength of the reinforcing film is improved.
Description
technical field [0001] The invention relates to the technical field of FPC board production, in particular to a processing method for increasing the bonding force of a flexible circuit board reinforcing film. Background technique [0002] The flexible circuit board is characterized by lightness, thinness and shortness, so it is easy to cause problems such as scars and breakage during use, and the mechanical strength is small and easy to crack. The purpose of the reinforcing film is to strengthen the mechanical strength of the FPC and facilitate the surface mounting of parts. The material of the reinforcing film is generally FR4 material, PET material, steel sheet material or PI material, etc. [0003] The installation process of the reinforcement film is generally divided into two steps: reinforcement bonding and reinforcement pressing. Among them, the reinforcement fit is divided into thermal reinforcement and pressure-sensitive reinforcement. Thermal reinforcement means ...
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IPC IPC(8): H05K3/00H05K1/02
CPCH05K3/0058H05K1/0281
Inventor 张宇张岩江克明王东洲肖银军郑文清樊镇蜚胡瑛平罗荣林刘珏
Owner 广州源康精密电子股份有限公司