Copper-clad plate production process

Abstract

The invention provides a copper-clad plate production process, which uses a copper-clad plate production and processing device. The copper-clad plate production and processing device comprises a support frame, a bearing frame, a soaking pool, a bearing block, a movable grabbing mechanism, a processing block and a surface processing mechanism. The copper-clad plate production process provided by the invention can solve the following problems in the copper-clad plate production process: a, a current copper-clad plate raw material is soaked in resin liquid and then is taken out horizontally and gently, and a lot of resin liquid is adhered to the surface of the copper-clad plate raw material in the taking-out process; the thickness of the resin liquid soaked on the surface of the copper-clad plate raw material is difficult to master in the soaking process, and the resin liquid with the redundant thickness often needs to be removed after solidification; and b, in the traditional copper-cladplate production process, the soaked copper-clad plate raw material is directly blown by wind to be dried, and then the surface of the copper-clad plate raw material is treated, so that the treatmentmode needs a lot of time, and the efficiency is low.

Description

technical field [0001] The invention relates to the technical field of surface treatment of copper clad laminates, in particular to a production process of copper clad laminates. Background technique [0002] Copper-clad laminate is a plate material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. It is a printed circuit board of various forms and functions. , all of which are selectively processed, etched, drilled and copper-plated on the copper-clad laminate to make different printed circuits. The copper-clad laminate mainly plays the role of interconnection, insulation and support for the printed circuit board. , has a great influence on the transmission speed, energy loss and characteristic impedance of the signal in the circuit. Therefore, the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost and long-term reliability and...

AI Technical Summary

Problems solved by technology

[0005] The invention provides a copper clad laminate production process, which can solve the following problems in the production process of copper clad laminates: a. At present, the copper clad laminate raw materials are soaked in the resin liquid and taken out horizontally and gently. During the process of taking out the copper clad laminate raw materials There will be a lot of resin liquid on the surface, and it is difficult to grasp the thickness of the resin liquid soaked in the raw material surface of the copper clad laminate during the soaking process. It is often necessary to remove the excess thickness of the resin liquid after solidification; b. During the production process of traditional copper clad laminates , the soaked copper clad laminate raw materials are directly blown and dried, and then the surface is treated. This treatment method takes a lot of time and is inefficient

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