Printing device and process for thick-film conductor paste
A conductive paste and printing device technology, applied in printing devices, printing, printing machines, etc., can solve the problems of low efficiency of gold conductive paste and low product yield, and achieve easy understanding, good product yield, and overall structure simple effect
Pending Publication Date: 2020-12-25
深圳市品诚伟创电子有限公司
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Problems solved by technology
[0006] The invention provides a printing device and process of thick film conductor paste to solve the problems of low efficiency and low product yield of gold conductor paste in the prior art when making sensor element electrodes
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[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0030]Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wit...
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Abstract
The invention belongs to the technical field of thick-film conductor paste printing, and discloses a printing device and process for thick-film conductor paste. The printing device comprises an electrode element placing table and a thick-film conductor paste storage table, an electrode element is rotatably mounted on the electrode element placing table, and a printing rubber head is arranged rightabove the electrode element placing table; a first driving mechanism and a second driving mechanism are also arranged, wherein the first driving mechanism is used for driving the printing rubber headto move in the vertical direction and enabling the bottom end of the printing rubber head to be in contact with the peripheral surface of the electrode element on the electrode element placing table;the second driving mechanism is used for driving the printing rubber head to move in the horizontal direction and enabling the bottom end of the printing rubber head to be adhered to thick-film conductor paste on the thick-film conductor paste storage table, and the thick-film conductor paste is stored in a storage groove of the thick-film conductor paste storage table; and a third driving mechanism for driving the electrode element placing table to slide horizontally is also arranged. The printing process comprises the step of printing the electrode element by using the printing device. Theprinting device is high in use stability and good in product yield.
Description
technical field [0001] The invention belongs to the technical field of thick-film conductor paste printing, and in particular relates to a thick-film conductor paste printing device and a process thereof. Background technique [0002] Thick film conductor materials are generally used to provide conductive wiring between circuit nodes, and at the same time provide electrical connections between multilayer circuit conductor layers; provide termination areas to connect thick film resistors; provide components and film wiring and higher Electrical interconnection of level assembly; provide installation area, while installing components, etc. [0003] Thick-film conductor materials include noble metals and base metals, and thick-film conductor pastes made of thick-film conductor materials mainly include gold (Au), gold / palladium (Au / Pd), gold / platinum (Au / Pt), silver (Ag), silver / palladium (Ag / Pd), silver / platinum (Ag / Pt) and other noble metal conductor pastes, as well as copper...
Claims
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IPC IPC(8): B41F17/00B41M1/26
CPCB41F17/001B41M1/26B41P2217/50
Inventor 匡松涛
Owner 深圳市品诚伟创电子有限公司