Forming process of heat-conducting gasket containing directionally sorted carbon fibers

Abstract

The invention relates to a forming process of a heat-conducting gasket containing directionally sorted carbon fibers. The forming process comprises the following steps of: S1, providing a plurality ofwinding frames and carbon fiber yarns; S2, winding the carbon fiber yarns on the outer surfaces of the winding frames; S3, stacking and accumulating the plurality of winding frames on which the carbon fiber yarns are wound from bottom to top to form a pretreatment frame; S4, placing the pretreatment frame into a container, pouring liquid glue into the container, vacuumizing the interior of the container, and heating and curing the glue to form a prefabricated product; S5, cutting off the carbon fiber yarns along the inner wall of a through hole to separate the prefabricated product from the winding frames; S6, cutting the prefabricated product into a plurality of semi-finished products; and S7, polishing the two end surfaces of the semi-finished products obtained in the step S6 in sequence, so as to obtain a finished product of the heat-conducting gasket with the a smooth surface. The orientation of the carbon fibers is sorted, and two ends of the carbon fibers can be in contact witha radiator and an electronic element respectively, and meanwhile, the distance required for heat conduction of the carbon fiber yarns is shortened, therefore, the heat dissipation effect of the heat-conducting gasket is improved.

Description

technical field [0001] The present application relates to the technical field of heat-conducting gaskets, in particular to a forming process for directional and sorting heat-conducting gaskets containing carbon fibers. Background technique [0002] With the rapid development of the network, various electronic products are developing in the direction of miniaturization, refinement and high power, and the integration density of transistors has greatly increased. The substantial increase in electronic integration means that the electronic components packaged in the circuit board will generate more heat. If the heat is not conducted in time, it will cause rapid accumulation of heat in electronic products, which will increase the operating temperature of electronic components. High, affecting the normal operation of the equipment. [0003] At present, heat conduction pads are usually used to quickly transfer heat to the radiator, and heat conduction pads are usually used to impr...

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Problems solved by technology

[0004] In view of the related technologies mentioned above, the inventor believes that the carbon fiber orientation of the thermal pad produced in the current way is low, so that the defect that the thermal conductivity cannot be increased due to carbon fiber filling will still be formed

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