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Semiconductor equipment

A semiconductor and equipment technology, applied in the field of semiconductor chip manufacturing, can solve the problems of long time consumption and poor processing efficiency of semiconductor equipment, and achieve the effects of short time, improved processing efficiency and convenient adjustment

Active Publication Date: 2020-12-29
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention discloses a semiconductor device to solve the problem that it takes a long time to adjust the process pressure of a reaction chamber, which results in poor processing efficiency of the semiconductor device

Method used

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Embodiment Construction

[0021] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with specific embodiments of the present invention and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0022] The technical solutions disclosed by various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0023] Such as Figure 1 ~ Figure 3 As shown, the embodiment of the present invention discloses a semiconductor device, and the disclosed semiconductor device includes a reaction chamber 100 , ...

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Abstract

The invention discloses semiconductor equipment. The semiconductor equipment comprises a reaction cavity, a cold pump and a cover plate assembly; the cold pump is arranged at the outer side of a cavity wall of the reaction cavity, a first through hole is formed in the cavity wall of the reaction cavity, and the cold pump communicates with the reaction cavity through the first through hole; the cover plate assembly comprises a driving mechanism and a cover plate connected with the driving mechanism, part of the driving mechanism is fixedly arranged at the outer side of the cavity wall, the driving mechanism is connected with the reaction cavity in a sealed mode, the cover plate is located in the reaction cavity, and the driving mechanism drives the cover plate to move in an axial directionof the first through hole so that the distance between the cover plate and the first through hole can be adjusted; and in an axial direction of the first through hole, the projection, facing the cavity wall where the first through hole is located, of the cover plate and the first through hole at least partially overlap. According to the scheme, by means of the semiconductor equipment, the problemsthat the time consumed by adjustment of technology pressure of the reaction cavity is long, and consequently the processing efficiency of semiconductor equipment is low can be solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor chip manufacturing, in particular to a semiconductor device. Background technique [0002] At present, cold pumps are widely used in physical vapor deposition equipment for manufacturing thin films, which use the principle of condensation to absorb specific gases in the reaction chamber of semiconductor manufacturing equipment to increase the vacuum in the reaction chamber. The cold pump is installed in the reaction chamber and the cover plate located at the upper end of the cold pump adjusts the pumping capacity. [0003] When adjusting the distance between the cover plate and the pump port of the cold pump, it is necessary to open the reaction chamber, and then manually replace the support column between the cover plate and the pump port. However, the reaction chamber is a vacuum environment, so it is necessary to process the reaction chamber before opening the cavity, which leads to comp...

Claims

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Application Information

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IPC IPC(8): C23C14/56C23C14/54H01L21/67
CPCC23C14/56C23C14/54H01L21/67253
Inventor 郭宏瑞李冰
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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