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Chuck pin for clamping silicon wafer and device for holding silicon wafer

A chuck pin, silicon wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as long downtime and production capacity impact

Active Publication Date: 2021-01-05
XIAN ESWIN SILICON WAFER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It takes about half an hour to disassemble the worn chuck pins and assemble new chuck pins, and the relevant parts in the cleaning equipment need to be disassembled before the chuck pins are disassembled, so the entire replacement process of the chuck pins will take up to Four to five hours, in addition, a trial run process was required to verify that the equipment fitted with the new chuck pins was working properly, resulting in a long downtime that severely impacted production capacity

Method used

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  • Chuck pin for clamping silicon wafer and device for holding silicon wafer
  • Chuck pin for clamping silicon wafer and device for holding silicon wafer
  • Chuck pin for clamping silicon wafer and device for holding silicon wafer

Examples

Experimental program
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Embodiment Construction

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0022] see figure 1 , an embodiment of the present invention provides a chuck pin 100 for chucking a silicon wafer W, and the chuck pin 100 may include:

[0023] driven part 110;

[0024] detachably assembled to the abutment portion 120 of the driven portion 110,

[0025] Wherein, when the driven part 110 is driven, for example figure 1 When rotating around the driven rotation axis O1 shown in , the abutment portion 120 is at, for example, relative to the peripheral edge WE of the silicon wafer W figure 1 in the first position shown by the solid line with e.g. figure 1 In the first position, the abutting portion 120 abuts against the peripheral edge WE of the silicon wafer W to clamp the silicon wafer W, and in the second position In the second position, the abutment port...

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PUM

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Abstract

The embodiment of the invention discloses a chuck pin used for clamping a silicon wafer and a silicon wafer retaining device. The chuck pin can comprise a driven part and an abutting part; the abutting part is detachably assembled on the driven part; when the driven part is driven, the abutting part moves between a first position and a second position relative to the periphery of the silicon wafer; in the first position, the abutting part abuts against the periphery of the silicon wafer to clamp the silicon wafer; and in the second position, the abutting part moves away from the periphery of the silicon wafer so as to loosen the silicon wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductor production, in particular to a chuck pin and a silicon wafer holding device for clamping silicon wafers. Background technique [0002] In the process of performing single-wafer cleaning on silicon wafers by using the silicon wafer single-wafer cleaning equipment, it is necessary to maintain a single silicon wafer. A device for holding a silicon wafer in a conventional silicon wafer single-wafer cleaning device usually includes: a chuck for supporting the silicon wafer; a plurality of chuck pins arranged along the circumferential direction of the chuck; and a driving part, the driving part The plurality of chuck pins can be actuated to move the plurality of chuck pins relative to the periphery of the silicon wafer between a first position and a second position in which the plurality of chuck pins The pins abut against the periphery of the wafer to clamp the wafer and secure the wafer to the ...

Claims

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Application Information

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IPC IPC(8): H01L21/687
CPCH01L21/68721H01L21/68764
Inventor 苏建生吕天爽
Owner XIAN ESWIN SILICON WAFER TECH CO LTD