Semiconductor laser packaging structure

A packaging structure and laser technology, applied in the direction of semiconductor lasers, lasers, laser components, etc., can solve the problems of chip temperature and cooler temperature rise, semiconductor laser temperature rise, heat cannot be taken away in time, etc.

Pending Publication Date: 2021-01-05
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] When encountering abnormal working conditions, for example, the coolant circulation system fails, or when a sudden increase in current causes a large amount of extra heat to be generated, the system will immediately stop supplying power to the semiconductor laser after detecting the failure, but generally it is also necessary to With a certain feedback time, the temperature of the chip and the cooler will rise sharply and abnormally in a very short time. There are no corresponding technical measures to provide this protection

Method used

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Embodiment 1

[0029] The first embodiment of the present invention provides a semiconductor laser packaging structure, such as figure 1 As shown, it includes a laser chip 1 and a cooler 2, and the laser chip 1 is packaged on the first outer surface of the cooler 2;

[0030] Wherein, the cooler 2 includes a coolant inlet 3, a coolant outlet 4, and a microchannel pipeline 5, and a phase change material 6 is encapsulated in the cooler 2, and when the semiconductor laser is in an abnormal working state, the phase change The material 6 is used to cool the temperature of the laser chip 1 below a preset safe temperature.

[0031] A phase change material (Phase Change Material, PCM) is usually a material that can undergo a phase change in a certain temperature range under normal pressure. Because solid-liquid phase change latent heat storage has the advantages of high heat storage density, the phase change process is approximately isothermal and the volume change is small, and the structure is rel...

Embodiment 2

[0045] On the basis of Embodiment 1, in this embodiment, the packaging position of the phase change material 6 in the cooler 2 is illustrated. The phase change material 6 can be packaged at the end, both sides of the cooler, or any other suitable internal space. , and meet the requirements that the internal space of the packaged phase-change material 6 is isolated from the internal fluid channel of the cooler 2, as an optional implementation mode, the phase-change material 6 is packaged at the tail end of the cooler 2 for illustration in this embodiment.

[0046] An embodiment of the present invention provides a semiconductor laser packaging structure, such as figure 1 , figure 2 , image 3 As shown, it includes a laser chip 1 and a cooler 2, and the laser chip 1 is packaged on the first outer surface of the cooler 2;

[0047] Wherein, the cooler 2 includes a coolant inlet 3, a coolant outlet 4, and a microchannel pipeline 5, and a phase change material 6 is encapsulated in...

Embodiment 3

[0050] On the basis of Embodiment 1, in this embodiment, the packaging position of the phase change material 6 in the cooler 2 is illustrated. The phase change material 6 can be packaged at the end, both sides of the cooler, or any other suitable internal space. , and meet the requirement that the internal space of the packaged phase-change material 6 is isolated from the internal fluid channel of the cooler 2, as an optional implementation mode, in this embodiment, the phase-change material 6 is packaged around the cooler 2 for illustration.

[0051] An embodiment of the present invention provides a semiconductor laser packaging structure, such as Figure 4 As shown, it includes a laser chip 1 and a cooler 2, and the laser chip 1 is packaged on the first outer surface of the cooler 2;

[0052] Wherein, the cooler 2 is packaged with a phase-change material 6, and the phase-change material 6 is used to cool the temperature of the laser chip 1 below a preset safe temperature whe...

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PUM

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Abstract

The invention discloses a semiconductor laser packaging structure, which comprises a laser chip (1) and a cooler (2), and is characterized in that the laser chip (1) is packaged on the first outer surface of the cooler (2); and a phase-change material (6) is packaged in the cooler (2), and when the semiconductor laser is in an abnormal working state, the phase-change material (6) is used for cooling the temperature of the laser chip (1) to be lower than a preset safety temperature. According to the invention, the phase-change material is packaged in the cooler, and the latent heat of phase change of the phase-change material is utilized to absorb a large amount of heat generated when an additional system fails, thereby achieving the purpose of protecting the semiconductor laser chip.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a semiconductor laser packaging structure. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high conversion efficiency, and long life, making them widely used in industry, medical treatment, communication, information display and other fields. [0003] As the power of semiconductor lasers increases, the cooling design plays a very important role in ensuring the normal operation of semiconductor lasers. Therefore, various advanced cooler technologies have been applied, the most typical of which is pure copper microchannel coolers. The cooling The laser works with the assistance of an external cooling system. When the high-power semiconductor laser chip is working normally, it is cooled by coolant to ensure its normal operating temperature. [0004] However, semiconductor lasers are expensive and fragile semiconductor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/024
CPCH01S5/02423H01S5/02469
Inventor 刘刚刘洋赵鸿王文涛吕坤鹏陈三斌王钢唐晓军刘磊
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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