5G high-frequency MPI material drilling method

Abstract

The invention discloses a 5G high-frequency MPI material drilling method which the following steps that S1, laser is adopted for conducting circular drilling on an MPI press-fit workpiece; S2, the focal length is moved downwards by a micro distance, and laser drilling is suspended in the focal length moving-down process; the scanning speed of the galvanometer is reduced and the diameter of an effective light spot is increased, and circular drilling is continuously performed by adopting laser; S3, the focal length is moved downwards by a micro distance, and laser drilling is suspended in the focal length moving-down process; the scanning speed of the galvanometer and the diameter of the effective light spot are adjusted to a preset value, and circular drilling is continuously performed by adopting laser; S4, the focal length is moved downwards by a micro distance, and laser drilling is suspended in the focal length moving-down process; the scanning speed of a galvanometer and the diameter of an effective light spot are adjusted, and circular drilling is continuously performed; S5, the step S2 and the step S4 are repeated till drilling is completed. The invention provides the 5G high-frequency MPI material drilling method which can prevent inward shrinkage during drilling and ensure good hole pattern.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a 5G high-frequency MPI material drilling method. Background technique [0002] With the advent of the era of 5G development, electronic products are not only rapidly becoming miniaturized and multi-functional, but more prominent is the rapid development of signal transmission towards high frequency. As the basic component of electronic products, printed boards (PCBs) must rapidly increase Densification and high-precision requirements are developing, so it is particularly important to improve the hole quality of this type of product. [0003] The high-frequency MPI adhesive material is the basic material of the PCB board in the 5G era, and it needs to be drilled during processing. The current drilling methods are: [0004] 1. Mechanical drilling, mechanical drilling belongs to contact processing. It is mainly driven by a high-speed drilling machine to drill t...

AI Technical Summary

Problems solved by technology

However, since nanosecond-level short-pulse ultraviolet lasers are used at this stage, although they belong to the "cold processing" type, when processing the micro-holes of high-frequency products, the phenomenon of product heat accumulation will still occur, resulting in "heating" on the hole wall. damage”, although the condition of the hole wall is better than the effect of infrared laser processing, it still cannot meet the increasingly stringent quality requirements of the hole wall

[0007] At this stage, the conventional drilling method used in the past can no longer meet the quality requirements, especially the serious shrinkage of the rubber and the poor quality of the hole pattern have become the key parts that hinder the improvement of the metallization quality of the entire hole.

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