A kind of drilling method of 5g high-frequency MPI material

Abstract

The invention discloses a method for drilling a 5G high-frequency MPI material, comprising the following steps: S1, using a laser to perform circular drilling on an MPI press-fit workpiece; S2, moving the focal length down by a micro distance, and pausing during the downward movement of the focal length Laser drilling; reduce the scanning speed of the galvanometer and increase the effective spot diameter, and continue to use the laser for circular drilling; S3, move the focal length down a micro distance, and pause the laser drilling during the downward shift of the focal length; adjust the When the scanning speed of the galvanometer and the effective spot diameter reach the predetermined value, continue to use the laser for circular drilling; S4, move the focal length down by a small distance, and suspend the laser drilling during the downward movement of the focal length; adjust the scanning speed of the galvanometer and the effective spot Diameter, continue to use circular drilling; S5, repeat steps S2 and S4, until the drilling is completed. The invention provides a method for drilling a 5G high-frequency MPI material, which can avoid shrinkage during drilling and ensure a good hole shape.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a 5G high-frequency MPI material drilling method. Background technique [0002] With the advent of the era of 5G development, electronic products are not only rapidly becoming miniaturized and multi-functional, but more prominent is the rapid development of signal transmission towards high frequency. As the basic component of electronic products, printed boards (PCBs) must rapidly increase Densification and high-precision requirements are developing, so it is particularly important to improve the hole quality of this type of product. [0003] The high-frequency MPI adhesive material is the basic material of the PCB board in the 5G era, and it needs to be drilled during processing. The current drilling methods are: [0004] 1. Mechanical drilling, mechanical drilling belongs to contact processing. It is mainly driven by a high-speed drilling machine to drill t...

AI Technical Summary

Problems solved by technology

However, since nanosecond-level short-pulse ultraviolet lasers are used at this stage, although they belong to the "cold processing" type, when processing the micro-holes of high-frequency products, the phenomenon of product heat accumulation will still occur, resulting in "heating" on the hole wall. damage”, although the condition of the hole wall is better than the effect of infrared laser processing, it still cannot meet the increasingly stringent quality requirements of the hole wall

[0007] At this stage, the conventional drilling method used in the past can no longer meet the quality requirements, especially the serious shrinkage of the rubber and the poor quality of the hole pattern have become the key parts that hinder the improvement of the metallization quality of the entire hole.

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