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System and method for reducing noise in microphone

A technology of microphones and acoustic transducers, applied in the direction of microphone structure associations, microphones, electrostatic transducer microphones, etc., can solve problems such as noise in MEMS microphone components

Active Publication Date: 2021-01-05
KNOWLES ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The small size of MEMS microphone components can make them prone to noise problems

Method used

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  • System and method for reducing noise in microphone
  • System and method for reducing noise in microphone
  • System and method for reducing noise in microphone

Examples

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Embodiment Construction

[0032] Embodiments described herein relate generally to systems and methods for reducing noise in a microphone assembly, and in particular to a microphone assembly filled with a low thermal conductivity gas in an interior volume defined by a housing of the microphone assembly and / or defined by a thermal barrier disposed on at least a portion of the wall of the enclosure.

[0033] Small MEMS microphone assemblies allow for the incorporation of such microphone assemblies into compact devices such as mobile phones, laptop computers, wearable devices, TV / set-top box remote controls, and the like. The MEMS microphone industry faces a constant need to reduce footprint, package volume, power consumption and cost while increasing performance and reliability. Typically, the housing housing the components of the microphone assembly is filled with air. A small hole or aperture is defined in the acoustic transducer (e.g., a diaphragm) to allow air to flow from the outside of the housing ...

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Abstract

A microphone assembly comprises a substrate and an enclosure disposed on the substrate. A port is defined in one of the substrate or the enclosure. An acoustic transducer is configured to generate anelectrical signal in response to acoustic activity. The acoustic transducer comprises a membrane separating a front volume from a back volume of the microphone assembly. The front volume is in fluidiccommunication with the port, and the back volume is filled with a first gas having a thermal conductivity lower than a thermal conductivity of air. An integrated circuit is electrically coupled to the acoustic transducer and configured to receive the electrical signal from the acoustic transducer. At least a portion of a boundary defining at least one of the front volume or the back volume is configured to have compliance so as to allow pressure equalization. The first gas is different from the second gas.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to and the benefit of U.S. Provisional Application No. 62 / 673,585, filed May 18, 2018, and U.S. Provisional Application No. 62 / 780,869, filed December 17, 2018, the entire disclosure of said U.S. Provisional Application Incorporated herein by reference. technical field [0003] The present disclosure generally relates to systems and methods for improving signal-to-noise ratio in microphones. Background technique [0004] Microphone assemblies are commonly used in electronic equipment to convert sound energy into electrical signals. Advances in micro- and nanofabrication techniques have led to the development of increasingly smaller microelectromechanical systems (MEMS) microphone components. The small size of MEMS microphone components can make them susceptible to noise problems. Contents of the invention [0005] Embodiments described herein relate generally to systems and methods...

Claims

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Application Information

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IPC IPC(8): H04R1/04H04R19/04
CPCH04R1/04H04R19/04H04R2201/003H04R2410/03H04R1/083
Inventor 彼得·洛佩特M·佩德森M·昆特兹曼
Owner KNOWLES ELECTRONICS INC