Clamping device and heat exchange module based on clamping device

Abstract

The invention discloses a clamping device and a heat exchange module based on the clamping device, and relates to the technical field of refrigerators. The clamping device comprises a clamping devicebody, wherein the clamping device body is arranged in a box body; the clamping device body comprises a front clamping end and a rear clamping end; two pairs of boss structures are symmetrically arranged on two sides of the rear clamping end; an air duct, a chamber and a box body outer barrel are arranged in the box body; an electrical cabin is arranged on the outer side of the box body outer barrel; an electrical cabin back plate is arranged in the electrical cabin; and the front clamping end comprises a pair of side plates A. The invention further provides a heat exchange module based on theclamping device. The heat exchange module comprises the clamping device, wherein a heat exchange module body is arranged in the clamping device in a matched mode; and the periphery of the heat exchange module body is filled with a sealing material A. According to the clamping device and heat exchange module based on clamping device, a refrigeration end and a heat dissipation end of the heat exchange module body are connected together through the clamping device, so that the problems that when an existing semiconductor refrigerator adopts air cooling refrigeration, the heat exchange efficiencyis low, the refrigeration effect of a refrigerator body is poor, and moisture absorption and water drainage cannot be achieved are solved.

Description

Technical field[0001]The invention belongs to the technical field of refrigerators, and particularly relates to a clamping device and a heat exchange module based thereon.Background technique[0002]Semiconductor refrigerators have a completely different cooling principle from ordinary compressor refrigerators. When the semiconductor chip is energized, the energy level difference between the two materials is used to realize cooling and heating. Semiconductor refrigerators are small in size, light, and easy to carry. Therefore, the size and installation space requirements of the refrigerator assembly parts are relatively high, and they are as compact as possible to save space.[0003]At present, most semiconductor refrigerators on the market adopt direct cooling method for cooling. The structure is relatively simple and the space utilization rate is high, but the cooling effect is not good. For air-cooled cooling, a series of issues need to be considered, including how to effectively fix...

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Problems solved by technology

[0004] The object of the present invention is to provide a clamping device and a heat exchange module based on it. The refrigeration end and the heat dissipation end of the heat exchange module body are connected together through the clamping device, which solves the problem that the existing semiconductor refrigerator adopts air cooling. When cooling, the heat exchange efficiency is low, the cooling effect of the box is not good, and the problems of moisture absorption and drainage cannot be solved

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