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High-density interconnection chip structure

A high-density interconnection, chip structure technology, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as poor welding, and achieve the effect of reducing the difficulty of processing

Pending Publication Date: 2021-01-08
SUZHOU TF AMD SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the front-mounted interconnection chip is soldered to the flip-chip function chip, it is easy to have poor soldering.

Method used

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  • High-density interconnection chip structure
  • High-density interconnection chip structure
  • High-density interconnection chip structure

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Embodiment Construction

[0022] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the related application, not to limit the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application. It should also be noted that, for the convenience of description, only the parts related to the application are shown in the drawings.

[0023] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "radial", "axial", "upper", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings , is only for the convenience of describing the application and simplifying the description, ra...

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Abstract

The invention discloses a high-density interconnection chip structure, and the structure comprises: a chip assembly which comprises a functional chip and a connection chip, wherein the functional chipand the connection chip are connected with each other; and a susstrate, wherein the functional chip is connected to a first surface of the substrate, the first surface is provided with a groove, thegroove is located in a projection area of the functional chip on the substrate, the groove accommodates filling glue, the viscosity of the filling glue is increased along with temperature rise, and the connecting chip is arranged in the groove. The filling glue is arranged in the groove, the viscosity of the filling glue is increased along with temperature rise, the filling glue can support the connecting chip, the gap between the connecting chip and the functional chip is kept unchanged, the second welding spot is cooled to the normal temperature, and the second welding spot can still be connected with the connecting chip and the functional chip.

Description

technical field [0001] The present application relates to the field of chip technology, in particular to a high-density interconnection chip structure. Background technique [0002] Multi-chip module (MCM) packaging is to package multiple chips on a substrate to complete certain circuit functions. On the basis of multi-chip module XY two-dimensional packaging, a three-dimensional multi-chip module (3D-MCM) has emerged in the Z direction. It stacks chips together along the Z axis to maximize packaging density and reduce package size. [0003] 3D packaging includes embedding, where two or more flip-chip functional chips are connected to the front-mounted interconnect chip. Due to insufficient space, the front-mounted chip needs to be placed in a groove on the substrate. However, when the front-mounted interconnect chip is soldered to the flip-chip functional chip, poor soldering is prone to occur. Contents of the invention [0004] Accordingly, the present invention provi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L23/498H01L23/538
CPCH01L25/071H01L23/49838H01L23/5381H01L23/5383H01L23/5384H01L23/5386H01L2224/16225H01L2224/16145H01L2924/15311H01L2924/15153
Inventor 周云
Owner SUZHOU TF AMD SEMICON CO LTD
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