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Copper foil for flexible printed circuit boards

A flexible printing and substrate technology, applied in the directions of printed circuit parts, metal pattern materials, metal rolling, etc., can solve the problems of accumulated strain, reduce softening temperature, etc., and achieve the effect of improving flexibility

Active Publication Date: 2021-12-14
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In addition, as a method of improving the bendability of rolled copper foil, a method of increasing the final reduction ratio to develop the Cube orientation of the recrystallized texture, that is, a cubic texture, is known. However, if the final reduction ratio is high, there will be accumulated strain. The problem of lowering the softening temperature

Method used

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  • Copper foil for flexible printed circuit boards
  • Copper foil for flexible printed circuit boards
  • Copper foil for flexible printed circuit boards

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Embodiment

[0058] Hereinafter, examples are given to illustrate the present invention in more detail, but the present invention is not limited to these examples.

[0059] An ingot in which the elements described in Table 1 were added to oxygen-free copper (JIS-H3100C1020) was produced. This ingot is hot-rolled and cold-rolled at about 900° C., annealed, and face milled to remove surface scale. Then, cold rolling was performed before final annealing by using a multi-stage cold rolling mill until the thickness of the rolled copper strip was 2.0 mm. Then, at the final annealing heat treatment temperature determined by the above method (as figure 1 The temperature of the inflection point 2, which is the lowest temperature of the recrystallization zone), was carried out in a nitrogen atmosphere for 30 minutes of final annealing. Then, cold rolling was performed after final annealing at a rolling reduction of 99.4% until the final copper foil thickness was 12 μm.

[0060]

[0061] 1. Cond...

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Abstract

To provide a copper foil for a flexible printed circuit board that improves the flexibility of CCL. Copper foil for flexible printed circuit boards, which is a rolled copper foil containing 99.9% by mass or more of Cu and 0.0005 to 0.0220% by mass of P as an additive element, and the balance is composed of unavoidable impurities, wherein the copper-oriented crystal The orientation density is lower than 10, and the crystal orientation density of the Brass orientation is lower than 20.

Description

technical field [0001] This invention relates to the copper foil suitable for wiring members, such as a flexible printed circuit board. Background technique [0002] As electronic devices become smaller, thinner, and more functional, flexible printed circuit boards (flexible printed circuit boards, hereinafter referred to as "FPC") are widely used. [0003] FPC is an article in which wiring is formed by etching a copper clad laminate (Copper Clad Laminate, hereinafter referred to as CCL) obtained by laminating copper foil and resin, and covered with a resin layer called a cover layer. [0004] However, copper foil as a conductor of FPC requires not only flexibility, but also bending resistance characteristics that are not easily broken even after repeated bending, and high-speed transmission characteristics. [0005] Generally, copper foil for FPC is subjected to roughening treatment in which fine metal particles called roughened particles are formed on the surface, and var...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C9/00C22F1/08H05K1/09
CPCC22C9/00C22F1/08H05K1/09B21B1/40
Inventor 坂东慎介石野裕士
Owner JX NIPPON MINING & METALS CORP