The invention relates to the technical field of electrolytic
copper foils, in particular to a heat-resistant
copper foil and a preparation method thereof, the volume ratio of (220)
crystal face texture in the heat-resistant
copper foil is 70%-100%, and 80%-100% of
crystal boundaries are arranged along the [110]
crystal orientation. By forming a high-proportion (220) texture, an approximately single-
oriented crystal structure is further formed, and the high-purity texture enables crystal boundaries to be highly and orderly arranged along the [110]
crystal orientation; through the synergistic effect of the submicron columnar
crystal structure and the single (220) texture, the
copper foil is endowed with excellent
thermal stability. Moreover, after annealing, the grain size fluctuation is small, the (220) texture
retention rate is greater than or equal to 70%, and the grain coarsening rate which is more than 50% superior to that of similar copper foils in the prior art can be realized; the atomic arrangement characteristic of the (220) crystal face is combined with the columnar
crystal structure, so that the
copper foil has excellent
ductility while keeping high strength, the
heat stability, strength and
ductility of the
copper foil under the complex heat exchange condition are improved, and the requirements of the high-end field for the performance of the copper foil are met.