8results about How to "Smooth interface" patented technology

The invention provides an SIC chip and a manufacturing method thereof, and belongs to the field of semiconductors. The manufacturing method of the SIC chip comprises the steps that the SIC chip is provided, passivation layers are deposited on the inner wall and the bottom of a through hole, and the passivation layers extend to a metal covering layer around the through hole; forming a first PI layer on the surface of the passivation layer, and filling the through hole; a second PI layer is formed on the surface of the first PI layer, and the first PI layer and the second PI layer are opposite in adhesive property; and forming a plastic package layer on the surface of the second PI layer, wherein the plastic package layer covers the second PI layer and the metal covering layer. According to the invention, two PI layers with opposite colloidality are formed. By using the two PI layers, the surface stress gradient structure of the SIC chip can be formed, and the shear stress between the molding compound and the SIC chip in the thermal cycle process can be effectively reduced, so that the shear stress at the edge and the corner of the SIC chip can be reduced, the layering of the SIC chip and the molding compound and the cracking of the SIC chip can be avoided, and the service life of the SIC chip is prolonged. And physical property abnormity and electrical property failure of the device can be further avoided.

The invention discloses a high-entropy alloy composite coating material and a preparation method thereof. The method comprises the following steps: weighing powder according to the proportion of the high-entropy alloy composite coating material, and carrying out high-energy ball milling under the protection of inert gas to obtain mixed powder; preparing a high-entropy alloy coating by adopting a laser cladding process for the obtained mixed powder; and the prepared high-entropy alloy coating is subjected to heat treatment, the heat treatment temperature ranges from 800 DEG C to 1300 DEG C, the heat treatment time ranges from 1.0 h to 1.2 h, water quenching is conducted to the room temperature after heat treatment is finished, and the high-entropy alloy composite coating material is obtained. The eutectic high-entropy alloy coating is prepared through a laser cladding process method, the microstructure of the coating is changed through heat treatment and addition of ceramic particles, the hardness, wear resistance and corrosion resistance of the coating can be improved while the FCC + BCC double-phase eutectic microstructure in the coating is kept, and the coating has the advantages of being high in mechanical strength, good in corrosion resistance and the like. And the process can be adjusted according to application requirements to obtain high-entropy alloy coatings with different properties, and industrial application is facilitated.

The present invention belongs to the field of semiconductor device technology, and particularly relates to a method for preparing an acoustic resonator structure. By configuring a fin module with a pre-set size, the resonator can provide a natural frequency that matches the measurement, and because the fin module provides an additional electrical / mechanical conversion area, the wafer area occupied by the traditional two-dimensional structure is smaller under the same performance, which greatly improves the integration; the polarization state of the hafnium zirconium oxide-aluminum oxide superlattice structure can be changed by adjusting the external electric field, thereby further changing the natural frequency, and jointly expanding the adjustable frequency range of the resonator; at the same time, covering the hafnium zirconium oxide-aluminum oxide superlattice with a tungsten layer ensures the uniformity of the applied electric field. The present invention also provides a non-transient readable recording medium storing the method program and a system containing the medium, and the program can be called by a processing circuit to execute the above method.

The application belongs to the technical field of semiconductor processing and manufacturing, and provides a preparation method of SOI material and SOI wafer, which comprises sequentially preparing an aluminum nitride layer, an aluminum oxide layer and a top layer of silicon on a first substrate to obtain a first bonding body; providing a support substrate provided with a buried oxygen layer as a second bonding body, and bonding the first bonding body and the second bonding body to obtain a bonding structure; and then sequentially removing the first substrate, the aluminum nitride layer and the aluminum oxide layer in the bonding structure to expose the top layer of silicon and obtain the SOI material. The ion implantation process is replaced and omitted by the combination of epitaxial growth, bonding and removal processes, so that the performance problems caused by the introduction of various defects can be avoided, the accurate control of the thickness of the top layer of silicon and the quality of the buried oxygen layer can be facilitated, the complexity of the process and the process cost can be reduced, and the application is particularly suitable for the batch production of 300mm and above large-size SOI wafers.

A kind of high-temperature-resistant heat-insulating fiber felt connecting structure, heat-insulating layer body includes left piece and right piece, the upper end of the left piece is equipped with the upper sewing piece of integral structure, the lower end of the right piece is equipped with the lower sewing piece of integral structure, the upper sewing piece is sewn with lower sewing piece by sewing structure and point glue structure and is equipped with on the heat-insulating layer body, the integral structure;The sewing structure includes: first sewing edge, second sewing edge and third sewing edge, the first sewing edge, second sewing edge are both double-thread needle method sewing, the third sewing edge double-thread needle method sewing is sewn back, the needle hole of the first sewing edge, second sewing edge and third sewing edge is filled with point glue structure.In sewing, first sew middle positioning, then sew two sides.The design not only interface smooth, good integrity, seam efficiency approaches 100%, significantly improves the overall mechanical properties of large, heterotypic size fiber felt, and needle hole is carried out point glue treatment to avoid heat transfer through needle hole, improve mechanical properties.

The invention discloses a lithium battery diaphragm, a battery cell, a lithium ion battery and an electronic device. A continuous coating side heat-resistant coating is formed on one surface of a base membrane of the lithium battery diaphragm, a continuous coating side glue coating is formed on the surface, far away from the base membrane, of the continuous coating heat-resistant coating, and the other surface of the base membrane is coated with a heat-resistant coating at intervals; and gluing the surface, far away from the base film, of the interval coating side heat-resistant coating and the surface of the interval coating side base film to form an interval coating side glue coating. When the lithium battery diaphragm disclosed by the invention is used for winding a pole group, an overlapping region of the heat-resistant coating on the interval coating side and the surface adhesive coating falls in a corner region of the pole group, and the single adhesive coating falls in a large-surface region of the pole group, so that the pole group can keep relatively good flatness after hot pressing, and the improvement of a positive and negative pole piece interface and battery performance in a full-charge state of a battery cell is facilitated; and the problem of lithium precipitation at the outer side of the negative electrode at the corner can be improved, and the safety performance and cycle performance of the battery are improved.

The invention belongs to the technical field of sodium ion batteries, and relates to a laminated quick-charge and quick-discharge sodium ion battery. Layered oxide and hard carbon are mainly used as main materials of a positive electrode and a negative electrode, activated carbon black SP and carbon nanotubes CNT are used as conductive agents, traditional sodium carboxymethyl cellulose CMC, styrene-butadiene rubber SBR, polyvinylidene fluoride PVDF and a newly added acrylic acid copolymer aqueous binder PAA are used as binders, ethylene sulfate DTD is additionally added to an electrolyte, and the lithium ion battery is prepared. And the laminated sodium ion battery prepared in a laminated manner is excellent in quick charging and discharging performance, and meanwhile, the stability of long-period circulation is ensured. The high-temperature-resistant low-temperature-resistant cable has excellent low-temperature resistance and also shows good performance advantages in a high-temperature environment.

The present application belongs to the field of batteries. The present application provides a kind of pole piece for improving surface flatness, its preparation method and battery, the preparation method includes that the coating layer of pole piece has formed is carried out re-coating, the mode of re-coating is gravure coating, control the particle size of substance in slurry used in re-coating is less than the particle size of substance in the coating layer that has formed, then carries out isostatic pressing treatment, forms re-coating layer.The specific re-coating layer formed by isostatic pressing treatment of the present application can prevent the generation of internal and surface defects of pole piece caused by roll pressing, improve the surface roughness and thickness uniformity of pole piece, effectively improve the surface flatness of pole piece and reduce interface impedance, optimize the solid-solid contact state and effect of electrode active material and solid electrolyte in pole piece, and further improve the cycle stability of battery.