Activation treatments in plating processes
A technology of activation treatment and electroplating process, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problems of reduced reliability, reduced performance, rough interface between electroplating layers, etc., to achieve the goal of reduced gaps, improved performance, and improved interface Effect
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[0026] The making and using of embodiments of the invention are described in detail below. It should be understood that many inventive concepts provided by these embodiments can be widely applied to various specific fields. The specific embodiments described are by way of illustration only and are not intended to be limiting.
[0027] In one embodiment, a novel process for forming an integrated circuit is provided. Intermediate stages in the manufacture of this embodiment are shown. Various embodiments are discussed in this disclosure. In different drawings and embodiments, similar reference numerals will be used to refer to similar elements.
[0028] refer to figure 1 , a wafer 2 comprising a substrate 10 is provided. The substrate 10 may be a semiconductor substrate such as a bulk silicon substrate, but may also include other semiconductor materials such as silicon germanium, silicon carbide, gallium arsenide, and the like. Semiconductor devices 14 such as transistors...
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