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Improved heat dissipation structure of evaporator

A technology of improving structure and evaporator, applied in cooling/ventilating/heating transformation, using liquid cooling for modification, etc., can solve the problems of low gas and liquid conversion efficiency, and achieve the effect of improving efficiency and improving heat dissipation efficiency

Inactive Publication Date: 2021-01-12
LDC PRECISION ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide an improved heat dissipation structure of an evaporator, which has solved the problem of low gas-liquid conversion efficiency in the prior art using water to dissipate heat

Method used

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  • Improved heat dissipation structure of evaporator
  • Improved heat dissipation structure of evaporator
  • Improved heat dissipation structure of evaporator

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Embodiment Construction

[0038] The technical content, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings.

[0039] see figure 1 , figure 2 , are the three-dimensional and plan schematic diagrams of the heat dissipation improvement structure of the evaporator of the present invention, respectively, as shown in the figure, at least one heat dissipation assembly 1 is included;

[0040] Wherein, the heat dissipation assembly 1 has an outer wall panel 11. In this embodiment, the outer wall panel 11 is divided into a first panel surface 111, a second panel surface 112, and a third panel surface 113, that is, the outer panel surface The wall panel 11 is formed by integrally forming or fixing the first panel surface 111, the second panel surface 112 and the third panel surface 113, wherein the second panel surface 112 and the third panel surface 113 are respectively located on the first panel ...

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Abstract

The invention relates to an improved heat dissipation structure of an evaporator, which comprises at least one heat dissipation assembly, the heat dissipation assembly is provided with an outer wall plate, the bottom of the outer wall plate extends upwards to form an inner wall plate, the inner wall plate divides the lower part in the outer wall plate into two water evaporation areas, and a gas concentration area is formed at the upper part in the outer wall plate; a plurality of heat dissipation assemblies are continuously arranged in the same direction to form a heat dissipation module, andthe heat dissipation module is arranged in a shell in a sealed mode to be used as an improved heat dissipation structure of the evaporator. According to the improved heat dissipation structure of theevaporator, the contact area between the improved heat dissipation structure and a heating source is larger, and the heat dissipation effect is improved. The water body is distributed in each water body evaporation area, and the single water body evaporation area is heated to evaporate the water body more quickly, so that the evaporation benefit is improved. Moreover, evaporated gas is concentrated in the gas concentration area to form higher pressure and can reach the condenser more quickly when being sent out, so that the conversion efficiency of the gas and the water body is improved.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to an improved heat dissipation structure of an evaporator. Background technique [0002] In recent years, the calorific value of electronic components has continued to increase rapidly with the improvement of semiconductor manufacturing processes. How to improve the heat dissipation capability of electronic components and maintain the normal operation of components has become a very important engineering topic. [0003] In the existing technology, the widely used direct air cooling technology has been unable to meet the heat dissipation requirements of many electronic components with high heat flux. In addition to the air cooling technology, there is also the use of liquid and gas conversion in water to achieve heat dissipation. This technology Provide two sets of heat spreaders and two sets of connected pipes, one set of heat spreaders is used to evaporate to take away the absorbed ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20309
Inventor 徐启峰梁政仁陈志玮
Owner LDC PRECISION ENG